VIZTA · Project

Advanced 3D Imaging Sensors for Automotive, Smart Buildings, and Industrial Safety

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Imagine giving machines the ability to see in 3D the way we do — measuring depth, recognizing faces, and mapping rooms all at once. VIZTA built next-generation sensor chips that use tiny lasers and ultra-fast light detectors to create detailed 3D images of everything around them, from a few centimeters to hundreds of meters away. Think of it like upgrading a regular camera to one that also knows exactly how far away every object is, all on a single chip small enough to fit in your car or your office ceiling. The team built working prototypes for self-driving car systems, building security, and factory robotics.

By the numbers

77,000+

measurement points in high-resolution ToF sensor module

application demonstrators built and validated

consortium partners across Europe

countries represented in consortium

12-inch

silicon wafer size for mainstream manufacturing compatibility

79%

industry partner ratio in consortium

The business problem

What needed solving

Companies building autonomous vehicles, smart buildings, and industrial robots need accurate, affordable 3D sensing — but current LiDAR and depth cameras are too bulky, too expensive, or too low-resolution for mass deployment. The core challenge is getting high-quality 3D imaging onto a single chip that can be manufactured cheaply at scale using standard semiconductor processes.

The solution

What was built

The project built a high-resolution time-of-flight sensor module with over 77,000 measurement points and integrated laser source, plus a VGA-resolution depth camera with on-chip filters. They delivered 6 working application demonstrators including an automotive wide-angle in-cabin monitoring system and an ultra-low-power smart building management sensor.

Audience

Who needs this

Automotive Tier-1 suppliers developing ADAS and driver monitoring systemsBuilding automation companies upgrading from basic motion sensors to 3D occupancy mappingWarehouse and logistics robotics companies needing better obstacle detectionSecurity and access control companies integrating 3D facial recognitionConsumer electronics makers adding depth sensing to devices

Business applications

Who can put this to work

Automotive

enterprise

Target: Tier-1 automotive suppliers and OEMs developing ADAS and autonomous driving systems

If you are an automotive supplier struggling with the cost and bulk of current LiDAR systems — this project developed high-resolution time-of-flight sensor modules with over 77,000 measurement points and integrated VCSEL lasers on standard 12-inch silicon wafers. They also built a working wide-angle in-cabin monitoring demonstrator for driver attention tracking. This means smaller, cheaper 3D sensing that can be manufactured at semiconductor scale rather than assembled from discrete optics.

Smart Buildings & Facility Management

mid-size

Target: Building automation companies, commercial real estate operators, and smart office solution providers

If you are a building automation company looking to improve occupancy sensing and energy management beyond basic motion detectors — this project delivered an ultra-low-power 3D sensor demonstrator specifically for smart building management. It can map room occupancy and movement patterns in 3D, enabling far more precise HVAC control and space utilization analytics than legacy PIR sensors. The technology was validated in a dedicated embedded demonstrator.

Industrial Automation & Robotics

any

Target: Companies deploying mobile robots in warehouses, logistics centers, and factory floors

If you are deploying mobile robots and struggling with navigation accuracy or collision avoidance in dynamic environments — this project developed VGA-resolution depth cameras with integrated filters and optics for real-time 3D mapping. The consortium included DFKI (German AI research) and multiple robotics partners who built demonstrators for mobile robotics in smart city and Industry 4.0 scenarios. These sensors enable robots to perceive obstacles and navigate complex spaces at much higher resolution than current solutions.

Frequently asked

Quick answers

What would this technology cost compared to current 3D sensing solutions?

The project specifically targeted cost-effectiveness by building sensors on standard 12-inch silicon wafers, which is the mainstream semiconductor manufacturing size. This means production can leverage existing high-volume chip fabrication lines rather than custom optics assembly. Exact pricing is not published, but the silicon-integrated approach is designed to dramatically reduce per-unit costs compared to discrete LiDAR systems.

Can this be produced at industrial scale?

Yes — this is one of the core design goals. The sensing technologies were developed on 12-inch silicon wafers by STMicroelectronics, one of the world's largest semiconductor manufacturers. The VCSEL laser sources use wafer-level GaAs optics, meaning both sensors and light sources can be manufactured using standard semiconductor processes at high volume.

What is the IP situation and how can we license this?

The project was coordinated by STMicroelectronics with contributions from Philips, III-V Lab, and 25 other partners across 9 countries. IP is likely distributed among consortium members under the ECSEL Joint Undertaking framework. Licensing discussions would need to go through the individual technology owners, primarily STMicroelectronics for the SPAD and ToF sensor technologies.

How mature is this technology — is it ready for integration?

The project produced 6 application demonstrators including a working automotive in-cabin system and a smart building management unit. As an Innovation Action (IA) under ECSEL, the project targeted technology readiness levels 6-7. The prototypes are validated in relevant environments but would need productization engineering before mass deployment.

What sensing range and resolution can we expect?

Based on the project objectives, the high-resolution time-of-flight module achieves over 77,000 measurement points with integrated VCSEL, drivers, filters, and optics. The depth camera sensor reaches VGA resolution minimum. The project addressed short-range, medium-range, and long-range sensing including dedicated LiDAR systems.

Who are the key technology partners we would work with?

The consortium of 28 partners includes major semiconductor players (STMicroelectronics, Philips), automotive companies (Ibeo, Veoneer, Ficosa), security specialist Idemia, and robotics institute DFKI. Equipment suppliers Applied Materials and Semilab supported manufacturing processes. This mix of 22 industrial partners provides a clear path from chip design to end application.

Consortium

Who built it

The VIZTA consortium is exceptionally industry-heavy at 79% (22 out of 28 partners), which signals strong commercial intent rather than purely academic research. It is coordinated by STMicroelectronics, a global top-10 semiconductor company with direct manufacturing capability. The partnership includes automotive heavyweights Ibeo and Veoneer (now part of Qualcomm and Magna respectively), security leader Idemia, and equipment supplier Applied Materials — meaning the full value chain from chip fabrication to end-product integration is represented. With 4 SMEs in the mix and partners from 9 countries including France, Germany, Spain, and Sweden, this consortium has both the manufacturing muscle and the application diversity to bring sensor products to market. The presence of CEA-Leti and DFKI adds deep technical backing without diluting the commercial focus.

STMICROELECTRONICS CROLLES 2 SASCoordinator · FR
BCB Informatica y Control S.L.participant · ES
IN SMART IDENTITY FRANCEparticipant · FR
STMICROELECTRONICS FRANCEparticipant · FR
TRUMPF PHOTONIC COMPONENTS GMBHparticipant · DE
ALTER TECHNOLOGY TUV NORD SAparticipant · ES
SEMILAB FELVEZETO FIZIKAI LABORATORIUM ZARTKORUEN MUKODO RESZVENYTARSASAGparticipant · HU
FICOSA AUTOMOTIVE SLparticipant · ES
COMMISSARIAT A L ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVESparticipant · FR
APPLIED MATERIALS FRANCEparticipant · FR
LUMIBIRDparticipant · FR
MAGNA ELECTRONICS SWEDEN ABparticipant · SE
KEOPSYS INDUSTRIESparticipant · FR
ISD LYSEIS OLOKRIROMENON SYSTIMATONANONYMOS ETAIREIAparticipant · EL
IEE INTERNATIONAL ELECTRONICS & ENGINEERING SAparticipant · LU
DEUTSCHES FORSCHUNGSZENTRUM FUR KUNSTLICHE INTELLIGENZ GMBHparticipant · DE
UNIVERSITAT POLITECNICA DE CATALUNYAparticipant · ES
IBEO AUTOMOTIVE SYSTEMS GMBHparticipant · DE
STMICROELECTRONICS (ALPS) SASthirdparty · FR
IDNEO TECHNOLOGIES SAUparticipant · ES
III-V LABparticipant · FR
FUNDACIO EURECATparticipant · ES
ELEKTRONIKAS UN DATORZINATNU INSTITUTSparticipant · LV
STMICROELECTRONICS GRENOBLE 2 SASparticipant · FR

How to reach the team

STMicroelectronics Crolles 2 SAS (France) — contact via SciTransfer for a warm introduction to the project team

Order a report on this consortium See STMICROELECTRONICS CROLLES 2 SAS profile →

Next steps

Talk to the team behind this work.

Want to explore how VIZTA's 3D sensing technology fits your product roadmap? SciTransfer can arrange a direct introduction to the right technical contact in the consortium. Contact us for a one-page technology brief.

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