III-V LAB

Their core work

III-V LAB is a French research laboratory specializing in III-V compound semiconductor technologies — the advanced materials (like InP, GaN, GaAs) that power photonic integrated circuits, high-frequency transceivers, and infrared detectors. They design and fabricate semiconductor components for telecommunications, 5G/6G wireless networks, space-grade imaging sensors, and medical photonics. Their work spans the full chain from epitaxial wafer growth and chip design through to packaging and system-in-package integration, making them a critical enabler for Europe's photonics and microelectronics supply chain.

What they specialise in

How they've shifted over time

In the early period (2015–2018), III-V LAB focused on foundational semiconductor research: terahertz transceivers (iBROW), SiC substrates (OSIRIS), thermal photonics management (TIPS), and initial work on photonic assembly and packaging (PIXAPP). From 2019 onward, the focus shifted decisively toward application-ready systems — high-speed datacenter transceivers (TWILIGHT, NEBULA, TERIPHIC), 5G/D-band radio frequency components (DRAGON, 5G_GaN2), and system-in-package integration with growing attention to reliability and manufacturability (iRel40). The trajectory is clear: from component-level III-V semiconductor research toward full system integration and volume manufacturing readiness.

III-V LAB is moving from research-grade semiconductor devices toward production-ready system-in-package solutions for 5G infrastructure and terabit-class datacenter optics — expect them to seek partners with packaging automation and volume testing capabilities.

How they like to work

III-V LAB operates primarily as an active technical partner (29 of 33 projects as participant), contributing deep semiconductor fabrication and design expertise to large European consortia. With 317 unique partners across 27 countries, they are a well-connected hub in Europe's photonics ecosystem rather than a niche player loyal to a small circle. Their 3 coordinator roles (OSIRIS, PICTURE, cFLOW) show they can lead projects when the topic sits squarely in their III-V materials sweet spot, but they clearly prefer contributing specialized capabilities to broader platform projects.

III-V LAB has collaborated with 317 unique partners across 27 countries, making them one of the most broadly connected photonics labs in H2020. Their network spans the full European photonics value chain from academic groups to industrial integrators, with particularly dense connections in Western European semiconductor hubs (France, Germany, Netherlands, Belgium).

What sets them apart

III-V LAB occupies a rare position as a dedicated III-V compound semiconductor lab that bridges academic research and industrial fabrication — they can grow epitaxial wafers, design MMICs, build photonic circuits, AND package them into working systems. Unlike university labs that stop at proof-of-concept or large fabs that only do volume production, III-V LAB covers the critical middle ground where prototype devices become manufacturable components. For consortium builders, they bring both the materials science depth and the system integration perspective that most partners can only offer one of.

Highlights from their portfolio

• InPulse
  Largest single EC contribution (EUR 1.65M) — an InP pilot line project aimed at building a self-sustained European PIC manufacturing ecosystem.
• PICTURE
  Coordinator role on heterogeneous III-V/Si photonic integration — directly aligned with their core mission of bringing III-V materials onto silicon platforms.
• TWILIGHT
  EUR 991K for 1.6 Tb/s system-in-package datacenter transceivers — represents the convergence of their photonics, packaging, and high-speed electronics expertise.