Central to both WAYTOGO FAST (advanced substrate technology) and 3DAM (3D advanced metrology for next-gen devices).
APPLIED MATERIALS FRANCE
Semiconductor equipment giant's French subsidiary, contributing metrology, materials engineering, and sensing technology expertise to European electronics pilot lines.
Their core work
Applied Materials France is the Bernin-based subsidiary of the global semiconductor equipment leader, providing advanced materials engineering and metrology solutions for chip manufacturing. Within H2020, they contribute specialized process and metrology expertise to large European electronics pilot lines and R&D consortia. Their work spans fully-depleted silicon-on-insulator (FDSOI) substrate technology, 3D metrology for advanced semiconductor devices, smart power electronics, and sensing technologies such as LiDAR and single-photon detectors.
What they specialise in
Contributed to R3-PowerUP, a 300mm pilot line for smart power and power discrete devices.
Participated in VIZTA, focused on Time-of-Flight sensing, SPADs, VCSELs, and LiDAR for security and Industry 4.0 applications.
Both R3-PowerUP and WAYTOGO FAST involve pilot-line-scale semiconductor fabrication processes.
How they've shifted over time
Their early H2020 work (2015–2016) focused on fundamental semiconductor substrate and metrology challenges — advancing FDSOI architectures and 3D measurement techniques for next-generation devices. From 2017 onward, their focus shifted toward application-driven domains: smart power electronics for energy efficiency and CO2 reduction, plus photonic sensing technologies (LiDAR, SPADs) targeting security, biometrics, and Industry 4.0. This trajectory mirrors the broader semiconductor industry's move from process R&D toward application-specific integration.
Moving from core semiconductor process R&D toward application-oriented technologies in sensing, energy efficiency, and Industry 4.0 — expect future interest in automotive LiDAR and green power electronics.
How they like to work
Applied Materials France operates exclusively as a participant, never leading consortia — consistent with their role as an equipment and process supplier contributing specialized capabilities to large industry-driven projects. Their consortia are large (96 unique partners across 22 countries), typical of ECSEL Joint Undertaking projects that assemble entire semiconductor value chains. They function as a trusted technology provider that major European electronics consortia call upon for materials and metrology expertise.
Connected to 96 unique partners across 22 countries, primarily through large ECSEL consortia that represent the European semiconductor ecosystem. Their network spans the full electronics value chain from research institutes to chip manufacturers and end-user industries.
What sets them apart
As the French arm of the world's largest semiconductor equipment company, they bring industrial-grade materials engineering and metrology capabilities that few European partners can match. Located in Bernin near the Grenoble semiconductor cluster (CEA-Leti, STMicroelectronics), they sit at the heart of France's microelectronics ecosystem. For consortium builders, they offer credibility, equipment access, and deep process expertise that strengthens any pilot-line or advanced manufacturing proposal.
Highlights from their portfolio
- WAYTOGO FASTLargest EC contribution (EUR 60,519) — focused on next-generation FDSOI substrate architecture, a critical European semiconductor competitiveness topic.
- VIZTAMost application-diverse project, bridging photonics with security, biometrics, and Industry 4.0 — signals their move into high-growth sensing markets.
- R3-PowerUP300mm pilot line project connecting semiconductor manufacturing to energy saving and CO2 reduction — longest-running project (2017–2023).