STMICROELECTRONICS GRENOBLE 2 SAS

Their core work

STMicroelectronics Grenoble 2 is a major semiconductor R&D division of STMicroelectronics, one of Europe's largest chip manufacturers. They design and develop advanced FDSOI (Fully Depleted Silicon on Insulator) semiconductor technologies, microcontrollers, non-volatile memory, and radiation-hardened processors for automotive, space, IoT, and industrial applications. Their work spans from silicon process development through pilot lines to system-on-chip design, bridging the gap between foundry-level fabrication and application-specific integrated circuits. They are a key player in Europe's push for semiconductor sovereignty, contributing to multiple ECSEL joint undertaking initiatives.

What they specialise in

How they've shifted over time

In the early period (2015-2018), STMicroelectronics Grenoble focused on IoT platforms and smart farming applications (IoF2020), small-cell network infrastructure (SESAME), and foundational FDSOI process development (WAYTOGO FAST), acting primarily as a component supplier into large-scale IoT pilots. From 2019 onward, the focus shifted decisively toward AI-enabled edge computing, advanced memory technologies (phase change, MRAM, OxRAM), and higher-node FDSOI processes — reflected in projects like ANDANTE, StorAIge, and TEMPO. The trajectory shows a clear move up the value chain: from providing chips for IoT connectivity toward designing intelligent, AI-capable silicon that processes data locally on the device.

STMicroelectronics Grenoble is converging its FDSOI, memory, and AI expertise toward ultra-low-power edge AI chips — expect future work in on-device inference for automotive, industrial, and space applications.

How they like to work

Overwhelmingly a participant (22 of 24 projects) rather than a coordinator, which is typical for large industrial companies that contribute specialized silicon expertise to consortia led by research organizations or integrators. They coordinated only two projects — both in their strongest niche of space-grade processors (DAHLIA) and edge AI (ANDANTE). With 475 unique partners across 29 countries, they operate as a hub organization that different consortia seek out for their semiconductor capabilities, rather than building tight clusters with repeated partners.

With 475 unique consortium partners across 29 countries, STMicroelectronics Grenoble has one of the broadest collaboration networks in European semiconductor R&D. Their partnerships span the full ecosystem from academic labs to automotive OEMs, with particularly strong ties to French, German, Italian, and Dutch institutions.

What sets them apart

STMicroelectronics Grenoble brings something rare to any consortium: actual semiconductor fabrication and pilot line capability combined with deep design expertise in FDSOI technology. Unlike university labs that prototype or software companies that simulate, they can take a concept from chip design through pilot production — which is critical for projects aiming at TRL 6+ demonstrators. Their dual strength in both space-grade radiation-hardened electronics and commercial IoT/automotive chips means they can bridge typically separate worlds of high-reliability and high-volume semiconductor design.

Highlights from their portfolio

• DAHLIA
  One of only two projects they coordinated — developed a radiation-hardened 28nm FDSOI microprocessor for space, combining their core FDSOI and space electronics expertise.
• OCEAN12
  Their largest single funding (EUR 1.19M) — pushed FDSOI technology to 12nm for autonomous driving, representing the intersection of their semiconductor process and automotive ambitions.
• HERMES
  Highest EC contribution at EUR 1.4M — qualifying a high-performance programmable microprocessor for space, showing continued strategic investment in space-grade silicon.