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Organization

ISD LYSEIS OLOKRIROMENON SYSTIMATONANONYMOS ETAIREIA

Greek SME specializing in custom ASIC, FPGA, and SoC design for space, automotive, and high-reliability sensor applications.

Technology SMEdigitalELSME
H2020 projects
11
As coordinator
0
Total EC funding
€2.3M
Unique partners
156
What they do

Their core work

ISD SA is a Greek semiconductor design company specializing in integrated circuit (IC) and system-on-chip (SoC) development for demanding applications including space, automotive, and security. They design ASICs, FPGAs, and mixed-signal electronics, with particular strength in radiation-hardened chips for satellite payloads and advanced sensor integration (LiDAR, time-of-flight). Their work spans the full chip design chain — from architecture definition through silicon validation — serving industries that require custom, high-reliability electronic systems.

Core expertise

What they specialise in

ASIC and SoC designprimary
5 projects

Core contributor across DAHLIA (rad-hard microprocessor), PROMISE (mixed-signal ASIC), DUROC (reprogrammable SoCs), WAYTOGO FAST (FDSOI substrate), and OCEAN12 (FDSOI for automotive).

3 projects

Consistent involvement in FDSOI-based projects: WAYTOGO FAST (28nm), DAHLIA (28nm FDSOI for space), and OCEAN12 (12nm FDSOI for autonomous driving).

Space-grade electronicssecondary
3 projects

DAHLIA developed rad-hard microprocessors for space, Hi-SIDE addressed satellite data systems, and PROMISE included radiation testing and qualification.

Advanced sensor systems (LiDAR, ToF)secondary
2 projects

VIZTA focused on time-of-flight sensors, SPADs, VCSELs, and LiDAR for biometrics and Industry 4.0; EXIST addressed extended image sensing.

FPGA and programmable architecturesemerging
2 projects

PROMISE explored FPGA-based architectures and DUROC targets ultra-reprogrammable SoCs, signaling a shift toward flexible hardware platforms.

Evolution & trajectory

How they've shifted over time

Early focus
FDSOI semiconductor and ASIC design
Recent focus
Programmable SoCs and sensor integration

In their early H2020 period (2015–2018), ISD focused on foundational semiconductor technology — FDSOI process nodes, ASIC design, and system-on-chip architectures for telecom and space payloads. From 2019 onward, their work shifted markedly toward application-driven chip design: LiDAR sensors for autonomous vehicles and smart buildings, programmable mixed-signal electronics, and reprogrammable SoCs. This evolution shows a company moving up the value chain from process-level semiconductor work toward full system integration with clear end-use applications.

ISD is moving toward flexible, reprogrammable hardware platforms (FPGAs, configurable SoCs) with growing emphasis on sensing applications — expect them to target smart mobility, industrial IoT, and dual-use space/terrestrial electronics.

Collaboration profile

How they like to work

Role: specialist_contributorReach: European20 countries collaborated

ISD operates exclusively as a participant — they have never coordinated an H2020 project, positioning themselves as a specialist contributor who brings focused IC design expertise to large, industry-driven consortia. With 156 unique partners across 20 countries and strong presence in ECSEL Joint Undertaking projects, they are deeply embedded in Europe's semiconductor ecosystem. Their consistent participation in multi-partner ECSEL consortia (often 30+ members) suggests they are a trusted, low-friction partner that integrates well into large collaborative efforts.

ISD has built an extensive network of 156 unique consortium partners across 20 countries, heavily weighted toward the European semiconductor and electronics supply chain through ECSEL Joint Undertaking projects. Their geographic reach spans most of the EU, with likely strong ties to France (STMicroelectronics ecosystem, given FDSOI focus) and other major European chip design hubs.

Why partner with them

What sets them apart

ISD occupies a rare niche as a Greek SME with deep expertise in custom chip design for high-reliability applications — space, automotive, and defense — sectors where Southern European IC design houses are uncommon. Their ability to work across the full semiconductor stack (from process technology like FDSOI to application-level sensor systems) makes them a versatile partner for consortia that need IC design capability without engaging a large semiconductor corporation. For consortium builders, they offer the technical depth of a specialized chip design house with the agility and cost-effectiveness of an SME.

Notable projects

Highlights from their portfolio

  • DAHLIA
    Highest-funded project (EUR 250K) developing a radiation-hardened microprocessor for space — demonstrates ISD's ability to deliver mission-critical silicon for the most demanding environments.
  • DUROC
    Their most recent and longest-running project (2021–2026), focused on ultra-reprogrammable SoCs — signals their strategic direction toward flexible, programmable hardware.
  • VIZTA
    Broadest application scope — combining time-of-flight sensors, LiDAR, and SPADs for biometrics, security, Industry 4.0, and smart buildings in a single project.
Cross-sector capabilities
Space (radiation-hardened electronics, satellite data systems)Automotive (autonomous driving sensors, FDSOI for vehicles)Security (surveillance systems, biometric sensors)Manufacturing / Industry 4.0 (smart sensor integration, programmable controllers)
Analysis note: Strong profile supported by 11 projects with clear thematic coherence. Keyword data was sparse for early projects (5 of 11 lack keywords), so evolution analysis relies partly on project titles and known ECSEL program context. The company website (isd.gr) would confirm additional commercial capabilities not visible in H2020 data alone.