Advanced semiconductor packaging (SiP, FOWLP, eWLB)
7 European H2020 organizations list this as part of their work — 4 as their primary capability.
Most active in this area
- BESI NETHERLANDS BV
Industrial semiconductor packaging and assembly equipment manufacturer specializing in SiP, FOWLP, and GaN power device pilot lines.
“Central to EuroPAT-MASIP, APPLAUSE, and CHARM — all focused on next-generation packaging architectures for diverse applications.”
PrimaryNL7 projects - Pac Tech - Packaging Technologies GmbH
German electronics packaging specialist providing wafer-level, sensor, and photonics assembly for European semiconductor pilot lines and IoT applications.
“Core packaging expertise runs through all four projects — from EuroPAT-MASIP's direct focus on SiP and FOWLP to APPLAUSE and CHARM where packaging enables sensor and IoT modules.”
PrimaryDE4 projects - INNOSENT GMBH
German radar and sensor hardware company specializing in advanced packaging, industrial IoT sensors, and emerging on-device AI for harsh environments.
“EuroPAT-MASIP focused on system-in-package assembly and fan-out wafer-level packaging; CHARM continued packaging work for IoT sensor modules.”
DE4 projects - INDIE SEMICONDUCTOR FFO GMBH
German SME designing CMOS radar and millimeter-wave RF semiconductors for 5G, automotive V2X, and IoT applications.
“EuroPAT-MASIP addressed System-in-Package and Fan-Out Wafer-Level Packaging pilot manufacturing.”
SMEDE3 projects - AFORE OY
Finnish SME delivering advanced semiconductor packaging for photonics, MEMS, and sensor system integration in European industrial consortia.
“Both EuroPAT-MASIP and APPLAUSE are explicitly centered on advanced packaging formats, with SiP, FOWLP, and eWLB named as core technical focus in EuroPAT-MASIP.”
PrimarySMEFI2 projects - ROODMICROTEC GMBH
German semiconductor packaging SME specializing in SiP, FOWLP, and photonics integration for European manufacturing projects.
“Both EuroPAT-MASIP and APPLAUSE list advanced packaging as a central keyword, with SiP, FOWLP, and eWLB appearing in EuroPAT-MASIP specifically.”
PrimarySMEDE2 projects