ROODMICROTEC GMBH

Their core work

RoodMicrotec is a German semiconductor services company specializing in advanced electronic packaging, assembly, and testing for microelectronics. Their work covers System-in-Package (SiP) technologies including Fan-Out Wafer Level Packaging (FOWLP/eWLB), as well as photonics and MEMS integration. In H2020 projects, they contributed practical manufacturing and packaging expertise to consortia developing next-generation sensor systems, optical transceivers, and miniaturized electronics. They operate as an industrial partner bringing real production-line knowledge — not just research — to European technology projects.

What they specialise in

How they've shifted over time

In their first H2020 project (2017), RoodMicrotec focused narrowly on packaging formats — SiP, FOWLP, eWLB — essentially the mechanical and structural side of integrating chips into packages. By their second project (2019), the scope broadened significantly into application domains: photonics, thermal infrared sensors, cardiac monitoring, gas measurement, and MEMS, suggesting they moved from format-level packaging toward system-level integration for specific end markets. The trend points toward a company applying packaging know-how to increasingly diverse sensing and photonics applications rather than staying within generic semiconductor assembly.

RoodMicrotec is moving from generic advanced packaging toward application-specific integration for sensing and photonics markets, making them a useful partner for any consortium needing manufacturing-ready packaging expertise in optical or sensor-based products.

How they like to work

RoodMicrotec participates exclusively as a consortium partner — they have not led any H2020 project — which fits their role as a specialist industrial contributor rather than a project driver. With 52 unique partners across 2 projects, they engage in large, multi-partner consortia, suggesting comfort working within complex pan-European teams. This profile is typical of an SME that brings defined technical services to projects rather than building and managing the research agenda itself.

RoodMicrotec has collaborated with 52 unique partners across 14 countries despite only two projects, indicating involvement in large, geographically broad consortia. Their network is solidly European, consistent with both projects being focused on European manufacturing competitiveness.

What sets them apart

RoodMicrotec is an industrial SME — not a university or institute — which means they bring production-level packaging capabilities that most research partners cannot. Based in Nördlingen, Germany, they sit within Europe's precision manufacturing heartland and offer testbed or pilot-line access that is rare in academic consortia. For any project needing to bridge lab-scale packaging research and actual manufacturability, they fill a gap that no research group can.

Highlights from their portfolio

• EuroPAT-MASIP
  Largest EC contribution (EUR 445,625) and focused on establishing a European pilot line for System-in-Package manufacturing — a strategic infrastructure goal rather than pure research.
• APPLAUSE
  Unusually broad scope combining photonics, MEMS, cardiac monitoring, and gas sensing under one packaging platform, showing RoodMicrotec's ability to serve multiple end-market applications simultaneously.