BESI NETHERLANDS BV

Their core work

BESI is a major semiconductor packaging and assembly equipment manufacturer, providing die attach, molding, and advanced packaging solutions to the global chip industry. Within H2020 projects, they contribute production-grade packaging expertise — particularly for System-in-Package (SiP), Fan-Out Wafer-Level Packaging (FOWLP), and embedded wafer-level ball grid arrays (eWLB). Their role spans pilot line development for power semiconductors, photonics packaging, and micro-fabricated medical devices, bridging the gap between lab-scale chip designs and volume manufacturing.

What they specialise in

How they've shifted over time

BESI's early H2020 work (2015–2018) concentrated on power semiconductor pilot lines — GaN components, 300mm wafer processing, and compact power applications. From 2017 onward, their focus shifted decisively toward advanced packaging architectures (SiP, FOWLP, eWLB) and broadened into new application domains: photonics, medical devices, and industrial IoT for harsh environments. This trajectory shows a company moving from material-specific manufacturing support toward becoming a platform-level packaging technology provider across multiple end markets.

BESI is expanding from power electronics into heterogeneous integration — packaging photonics, sensors, and medical components into compact modules — making them a strong partner for any project requiring advanced assembly and packaging at scale.

How they like to work

BESI participates exclusively as a consortium partner, never as coordinator, which is typical for large equipment manufacturers that contribute specialized capabilities rather than driving research agendas. Their 193 unique partners across 21 countries reflect participation in ECSEL-type mega-consortia (often 30–50+ partners each), positioning them as a well-connected industry node rather than a focused bilateral collaborator. Working with BESI means accessing a company that understands large-consortium dynamics and delivers defined industrial contributions on schedule.

With 193 unique consortium partners across 21 countries, BESI has one of the broadest collaboration networks in European semiconductor packaging. Their connections span the full ECSEL ecosystem — from silicon foundries and design houses to end-use application developers in medical, automotive, and telecom sectors.

What sets them apart

BESI is not a research lab or a design house — they are a production equipment company that brings real manufacturing capability to EU consortia. This makes them uniquely valuable for projects that need to move from prototype to pilot line, because they can validate that a packaging concept actually works on industrial equipment. Few H2020 participants can offer this direct path from R&D concept to volume-ready assembly process.

Highlights from their portfolio

• PowerBase
  Largest single EC contribution (€166K) — established BESI's role in GaN power semiconductor pilot lines for compact power applications.
• EuroPAT-MASIP
  Second-largest funding (€162K) and the project that marks BESI's pivot to advanced SiP/FOWLP/eWLB packaging technologies.
• APPLAUSE
  Broadest application scope — combining photonics, optics, MEMS, and medical sensors in a single packaging pilot line, showcasing BESI's cross-domain versatility.