Pac Tech - Packaging Technologies GmbH

Their core work

Pac Tech specializes in advanced electronics packaging — the critical step where semiconductor chips, sensors, and optical components are assembled into functional modules ready for integration into end products. They provide packaging technologies such as Fan-Out Wafer-Level Packaging (FOWLP), System-in-Package (SiP), and embedded wafer-level ball grid array (eWLB) solutions. Their work spans GaN power semiconductors, photonics packaging, MEMS, and sensor modules for industrial IoT and harsh-environment applications. Based in Nauen near Berlin, they serve European semiconductor and electronics manufacturing supply chains as a specialist packaging partner.

What they specialise in

How they've shifted over time

In their early H2020 participation (2015–2018), Pac Tech focused on foundational semiconductor packaging processes — GaN power device pilot lines and establishing European SiP/FOWLP/eWLB manufacturing capabilities. From 2019 onward, their work shifted toward application-driven packaging: photonics, sensor modules for healthcare and environmental monitoring, and ruggedized IoT systems for harsh industrial conditions. The trajectory shows a clear move from process-centric R&D toward packaging as an enabler of specific end-use applications, particularly in sensing and IoT.

Pac Tech is moving toward application-specific packaging for IoT sensors in demanding industrial and medical environments — expect growing relevance for consortia targeting smart manufacturing, environmental monitoring, or wearable health devices.

How they like to work

Pac Tech participates exclusively as a partner, never as coordinator, across all four projects — consistent with a specialist contributor that brings deep technical capability to larger consortia. With 116 unique partners across 20 countries, they integrate into large Innovation Action (IA) consortia focused on European pilot lines and manufacturing scale-up. This makes them a reliable, low-friction partner: they know how to operate within big EU projects without needing to lead, and their broad network suggests they are well-regarded across the European semiconductor ecosystem.

Pac Tech has collaborated with 116 distinct partners across 20 countries, entirely through large-scale Innovation Actions in the ICT pillar. Their network is deeply embedded in the European semiconductor and electronics manufacturing ecosystem, with strong pan-European reach.

What sets them apart

Pac Tech occupies a niche that few European companies cover: they are a dedicated advanced packaging house, not a chip designer or end-product manufacturer, but the essential link between the two. Their combination of wafer-level packaging, photonics assembly, and harsh-environment sensor integration makes them a rare one-stop packaging partner for consortia that need to move from lab prototypes to pilot-line manufacturing. For any project where the gap between "working chip" and "functional module" is the bottleneck, Pac Tech is a natural fit.

Highlights from their portfolio

• CHARM
  Their largest-funded project (EUR 173,375) and most recent, signaling their strategic direction toward IoT sensor systems for harsh industrial environments.
• APPLAUSE
  Broadest application scope — combines photonics, MEMS, medical sensors, and datacom in a single packaging-focused pilot line project.
• EuroPAT-MASIP
  Directly targets European packaging pilot line infrastructure for System-in-Package, representing the core of Pac Tech's manufacturing identity.