Photonics and optics packaging
3 European H2020 organizations list this as part of their work — 2 as their primary capability.
Most active in this area
- BESI NETHERLANDS BV
Industrial semiconductor packaging and assembly equipment manufacturer specializing in SiP, FOWLP, and GaN power device pilot lines.
“APPLAUSE specifically addressed packaging for photonics, optics, and electronics including light sensors and datacom transceivers.”
NL7 projects - AFORE OY
Finnish SME delivering advanced semiconductor packaging for photonics, MEMS, and sensor system integration in European industrial consortia.
“APPLAUSE (Advanced packaging for photonics, optics and electronics) places photonic and optical component integration at the center of AFORE's contribution.”
PrimarySMEFI2 projects - ROODMICROTEC GMBH
German semiconductor packaging SME specializing in SiP, FOWLP, and photonics integration for European manufacturing projects.
“APPLAUSE focused on advanced packaging for photonics and optics, covering datacom transceivers and light sensors.”
PrimarySMEDE2 projects