Photonic integrated circuit packaging and assembly
4 European H2020 organizations list this as part of their work — 4 as their primary capability.
Most active in this area
- ARGOTECH AS
Czech SME specializing in photonic integrated circuit packaging, assembly, and industrialization for telecom, health, aerospace, and sensing applications.
“Core contributor across PIXAPP (PIC pilot line), PICTURE (III-V/Si heterogeneous integration), TWILIGHT (1.6T transceivers), SEER, InSiDe, and PASSEPARTOUT.”
PrimarySMECZ9 projects - CORDON ELECTRONICS ITALIA SRL
Italian photonic integrated circuit packaging and assembly specialist serving telecom, space, and quantum communication projects across Europe.
“Core contributor to PIXAPP pilot line, HAMLET, 3PEAT, and OPTIMA — all centered on PIC integration and packaging for different platforms (TriPleX, PolyBoard, polymer).”
PrimaryIT5 projects - VANGUARD AUTOMATION GMBH
German SME specializing in photonic integrated circuit assembly, packaging, and testing across multiple material platforms for LiDAR, telecom, and sensing.
“Central to PIXAPP (packaging pilot line), OPHELLIA (on-chip laser assembly), and ELENA (LiNbO3 PIC platform).”
PrimarySMEDE4 projects - Linkra S.R.L.
Italian photonic integrated circuit packaging and assembly specialist, contributing to pilot lines for telecom, space, medical, and security applications.
“Central to all three projects: HAMLET (micro-photonics integration), OPTIMA (photonic payloads), and PIXAPP (PIC assembly and packaging pilot line).”
PrimaryIT3 projects