CORDON ELECTRONICS ITALIA SRL

Their core work

Cordon Electronics Italia specializes in the assembly, packaging, and testing of photonic integrated circuits (PICs). They provide critical manufacturing and integration services that turn photonic chip designs into functional, reliable devices — bridging the gap between lab-grade prototypes and industrially packaged components. Their work spans telecom, space, quantum communication, and sensor applications, consistently contributing packaging and reliability expertise to European photonic integration projects.

What they specialise in

How they've shifted over time

Cordon Electronics entered H2020 through photonic integration platform projects (HAMLET, OPTIMA) focused on telecom and space applications using polymer and TriPleX waveguide technologies. By 2017-2018, their focus expanded into industrialized PIC packaging through the PIXAPP pilot line and into quantum communication hardware via UNIQORN. The shift shows a company moving from application-specific packaging toward becoming a broader photonic manufacturing service provider with quantum technology capabilities.

Moving toward industrialized photonic chip packaging services with growing quantum technology capabilities — well-positioned as European quantum hardware supply chains mature.

How they like to work

Cordon Electronics operates exclusively as a participant, never leading consortia — consistent with a specialized service provider that contributes deep packaging expertise rather than driving research agendas. With 44 unique partners across 15 countries in just 5 projects, they work in large, diverse consortia typical of photonics infrastructure projects. This breadth of partnerships suggests they are a trusted, well-networked supplier that different research groups call upon for their specific manufacturing skills.

Broadly connected across European photonics with 44 unique partners in 15 countries from just 5 projects, indicating participation in large consortia alongside major photonic research groups and foundries.

What sets them apart

Cordon Electronics occupies a specific and hard-to-replace niche: they are a dedicated photonic chip packaging and assembly house participating in Europe's most important PIC integration projects. While many partners in these consortia design photonic circuits, Cordon provides the manufacturing bridge — turning wafer-level designs into packaged, tested, reliable devices. Their experience across telecom, space, and quantum domains makes them versatile packaging partners for any team needing to move photonic chips from prototype to product.

Highlights from their portfolio

• PIXAPP
  Largest funding (EUR 932K) — a dedicated PIC assembly and packaging pilot line that positions Cordon at the center of Europe's photonic manufacturing infrastructure.
• UNIQORN
  Extends their packaging expertise into quantum communication hardware, including QKD systems and entangled photon sources on chip — a significant technology frontier.
• 3PEAT
  3D multilayer photonic integration combining PolyBoard and TriPleX platforms for optical switching, demonstrating advanced multi-platform packaging capability.