Central to all three projects: HAMLET (micro-photonics integration), OPTIMA (photonic payloads), and PIXAPP (PIC assembly and packaging pilot line).
Linkra S.R.L.
Italian photonic integrated circuit packaging and assembly specialist, contributing to pilot lines for telecom, space, medical, and security applications.
Their core work
Linkra is an Italian company specializing in the assembly, packaging, and integration of photonic integrated circuits (PICs). Their H2020 involvement spans three projects focused on micro-photonics platforms, photonic payloads for telecom satellites, and PIC pilot line manufacturing. They contribute expertise in bridging the gap between photonic chip design and reliable, manufacturable packaged devices — a critical step in bringing photonic technologies from lab to market.
What they specialise in
OPTIMA focused on demonstrating photonic payloads for telecom satellites, their only funded project (EUR 50,082).
HAMLET addressed heterogeneous integration of polymer and TriPleX platforms for integrated micro-photonics.
PIXAPP keywords explicitly include test and reliability alongside assembly and packaging services.
How they've shifted over time
With only three projects starting between 2015 and 2017, Linkra's H2020 participation is compact. Their trajectory moved from hybrid material integration for micro-photonics (HAMLET, 2015) through space-grade photonic payloads (OPTIMA, 2016) to a broader PIC assembly pilot line serving multiple sectors including medical technology, communications, and security (PIXAPP, 2017). This suggests a progression from specialized R&D toward manufacturing-scale packaging services across application domains.
Linkra moved from research-stage photonics integration toward production-ready packaging services, positioning itself as a supply chain partner for companies needing to manufacture photonic devices at scale.
How they like to work
Linkra participates exclusively as a consortium partner, never leading projects. With 29 unique partners across 12 countries from just 3 projects, they join large, diverse consortia — likely contributing specialized packaging and assembly capabilities. This profile suggests a reliable specialist contributor that integrates into established teams rather than driving project direction.
Despite only three projects, Linkra has connected with 29 partners across 12 countries, reflecting their participation in large European consortia typical of photonics pilot line and demonstration projects.
What sets them apart
Linkra occupies a niche at the intersection of photonic chip design and physical product: the assembly, packaging, and test of photonic integrated circuits. This is a recognized bottleneck in photonics commercialization, where many research breakthroughs stall. Their involvement in PIXAPP — a dedicated pilot line — signals they can offer manufacturing-adjacent services that bridge prototyping and volume production.
Highlights from their portfolio
- PIXAPPA photonic integrated circuits pilot line project covering assembly, packaging, test, and reliability — directly aligned with Linkra's core business and serving sectors from medical technology to security.
- OPTIMALinkra's only funded project (EUR 50,082), focused on demonstrating photonic payloads for telecom satellites — showing their capability extends to space-grade applications.