If you are a quantum hardware company struggling with control electronics that fail at cryogenic temperatures below 4K — this project developed a nanomechanical FPGA demonstrator and non-volatile memory chip that operate at cryogenic temperatures where conventional CMOS suffers carrier freezeout. The packaged chips are designed for functions like qubit multiplexing and demultiplexing right next to the quantum processor, reducing wiring complexity.
Ultra-Low Power Computing Chips That Work in Extreme Heat and Cryogenic Cold
Imagine tiny mechanical switches — like light switches, but a thousand times thinner than a hair — that can replace the transistors inside computer chips. Regular chips leak power even when "off" and stop working when it gets really hot or extremely cold. ZeroAMP built computing chips using these nano-sized mechanical switches that use virtually zero power when idle and keep working from cryogenic freezing temperatures all the way up to extreme heat. Think of it as building a calculator out of miniature see-saws instead of electronic gates — it just works where normal electronics fail.
What needed solving
Electronics in extreme environments — whether the deep cold needed for quantum computers (below 4K) or the intense heat inside aircraft engines and electric vehicles — either fail outright or waste enormous power trying to stay functional. Current CMOS chip technology leaks power even when idle, and semiconductor physics breaks down at temperature extremes, forcing engineers into expensive workarounds like active cooling, redundant systems, or accepting limited component lifespans.
What was built
The project built 3 physical demonstrators: a manufactured and packaged non-volatile memory (NVM) chip, a manufactured and packaged FPGA (reprogrammable logic) chip, and discrete nanomechanical switches integrated into circuits on a breadboard. These represent the core components of a complete nanomechanical computing platform designed for extreme-temperature operation with near-zero standby power.
Who needs this
Who can put this to work
If you are an aerospace electronics supplier dealing with components that fail or derate at high operating temperatures — this project built a computing platform using nanomechanical switches that maintain performance across extreme temperature ranges. The consortium includes 3 semiconductor supply chain companies covering foundry to packaging, with a manufactured FPGA demonstrator ready for testing in harsh-environment applications.
If you are an IoT hardware company that needs processors for high-temperature environments like engine compartments or industrial furnaces — this project developed ultra-low power nanomechanical logic and memory chips that consume virtually zero standby power. The technology was demonstrated with 3 packaged hardware prototypes including an FPGA and non-volatile memory, built by a 7-partner consortium spanning the full semiconductor supply chain.
Quick answers
What would it cost to license or access this technology?
The project was coordinated by Microchip Technology (formerly Microsemi), a major semiconductor company. Licensing terms would need to be negotiated directly with the consortium. Given that 3 industry partners cover the full supply chain from foundry to packaging, commercial licensing paths likely exist but are not publicly disclosed.
Can this be manufactured at industrial scale?
The consortium specifically includes foundry partner XFAB and manufacturer AMO alongside Microchip Technology, covering the entire semiconductor supply chain. They demonstrated 3D stacking for large-scale integration. However, the deliverables describe demonstrator chips 'ready for final testing,' indicating the technology is not yet in volume production.
What is the IP situation — can we license this?
The project was industry-driven with Microchip Technology as coordinator. IP is likely held by the consortium partners. With 3 industrial partners out of 7 total (43% industry ratio), commercial exploitation was clearly a priority. Contact the coordinator for licensing availability.
Does this actually work, or is it still a lab concept?
ZeroAMP delivered 3 physical demonstrators: a manufactured and packaged non-volatile memory chip, discrete NEM switches integrated in circuits on a breadboard, and a manufactured and packaged FPGA chip. These are real, packaged hardware — beyond lab concept but still in the testing and validation stage.
How does this compare to existing low-power chip technologies?
Based on the project objective, the nanomechanical approach achieves energy efficiency and environmental capability that 'cannot be matched by CMOS or any experimental technologies currently on the horizon.' The key differentiator is zero leakage current in standby and operation across extreme temperatures where CMOS fails, particularly below 4K for quantum applications.
What specific applications has this been tested for?
The project targeted three application domains: Internet-of-Things requiring ultra-low power, all-electric vehicles and more-electric aircraft requiring high-temperature operation, and superconducting quantum circuits operating below 4K where conventional electronics suffer carrier freezeout. The FPGA demonstrator was designed for reprogrammable computing in these environments.
Who built it
This is a strong, industry-weighted consortium with 7 partners across 4 countries (Switzerland, Germany, Sweden, UK). What stands out is the 43% industry ratio — 3 out of 7 partners are companies, and they cover the entire semiconductor value chain: Microchip Technology (chip design and systems), XFAB (foundry/fabrication), and AMO (advanced manufacturing). This means the technology was developed with manufacturing scalability in mind from day one. The academic side brings KTH and University of Bristol, both strong in nanoelectronics, plus research institute CSEM. With 2 SMEs in the mix, this consortium was clearly structured to move beyond the lab toward commercial readiness.
- MICROCHIP TECHNOLOGY CALDICOT LIMITEDCoordinator · UK
- SCIPROM SARLparticipant · CH
- CSEM CENTRE SUISSE D'ELECTRONIQUE ET DE MICROTECHNIQUE SA - RECHERCHE ET DEVELOPPEMENTparticipant · CH
- KUNGLIGA TEKNISKA HOEGSKOLANparticipant · SE
- X-FAB MEMS Foundry GmbHparticipant · DE
- GESELLSCHAFT FUR ANGEWANDTE MIKRO UND OPTOELEKTRONIK MIT BESCHRANKTERHAFTUNG AMO GMBHparticipant · DE
- UNIVERSITY OF BRISTOLparticipant · UK
Microchip Technology Caldicot Limited (UK) — contact through SciTransfer for warm introduction to the project team
Talk to the team behind this work.
Want to explore licensing or partnership opportunities with the ZeroAMP team? SciTransfer can arrange a direct introduction to the consortium and provide a detailed technology brief tailored to your application.