SciTransfer
Organization

X-FAB MEMS Foundry GmbH

German MEMS foundry providing wafer-level fabrication for micro-transfer-printing, NEMS devices, and GaN power semiconductors.

Large industrial companydigitalDENo active H2020 projects
H2020 projects
4
As coordinator
1
Total EC funding
€1.3M
Unique partners
46
What they do

Their core work

X-FAB MEMS Foundry is a specialized semiconductor foundry based in Erfurt, Germany, providing MEMS and advanced wafer-level fabrication services. They operate pilot lines and production facilities for micro-transfer-printing, heterogeneous integration, and custom semiconductor processing. Their foundry capabilities support both established silicon technologies and emerging wide-bandgap materials like gallium nitride (GaN), serving clients who need reliable, scalable manufacturing for sensors, power devices, and logic circuits.

Core expertise

What they specialise in

Micro-transfer-printing and heterogeneous integrationprimary
2 projects

Coordinated MICROPRINCE (pilot line for micro-transfer-printing on wafer level) and participated in TOP HIT (transfer-print operations for heterogeneous integration).

MEMS/NEMS device fabricationprimary
1 project

Participated in ZeroAMP developing nanomechanical switch-based logic and non-volatile memory circuits.

GaN and wide-bandgap power semiconductor processingemerging
1 project

Contributed as third party to YESvGaN, focused on vertical gallium nitride power transistors on silicon substrates.

Wafer-level pilot line operationsecondary
2 projects

MICROPRINCE was explicitly a pilot line project, and TOP HIT involved transfer-print process development at foundry scale.

Evolution & trajectory

How they've shifted over time

Early focus
Micro-transfer-printing pilot lines
Recent focus
NEMS and GaN power devices

In the earlier period (2015–2020), X-FAB focused on micro-transfer-printing and heterogeneous integration — essentially building pilot lines to bond different functional components onto wafers (TOP HIT, MICROPRINCE). From 2020 onward, their work shifted toward more exotic device types: nanomechanical (NEMS) switches for ultra-low-power logic and memory (ZeroAMP), and vertical GaN power semiconductors (YESvGaN). This signals a clear move from process-level manufacturing R&D toward fabrication services for next-generation device architectures beyond conventional CMOS.

X-FAB is positioning its foundry capabilities to serve the post-CMOS device landscape — expect them to offer fabrication for NEMS-based logic, non-volatile memory, and wide-bandgap power electronics.

Collaboration profile

How they like to work

Role: infrastructure_providerReach: European10 countries collaborated

X-FAB has taken both leadership and supporting roles: they coordinated MICROPRINCE (an ECSEL pilot line project) and participated in RIA-type research consortia. With 46 unique partners across 10 countries from just 4 projects, they operate in large, multi-national consortia typical of ECSEL and semiconductor R&D programs. Their role as a foundry means partners come to them for fabrication access — they are an infrastructure enabler rather than a science driver.

X-FAB has collaborated with 46 unique partners across 10 countries in just 4 projects, reflecting the large consortium sizes typical of European semiconductor initiatives. Their network spans the major EU semiconductor ecosystems.

Why partner with them

What sets them apart

X-FAB is one of the few independent MEMS foundries in Europe that participates in EU-funded R&D, meaning they can take research-stage device designs and move them toward volume manufacturing. Their combination of micro-transfer-printing, NEMS, and GaN processing capabilities is unusual — most foundries specialize in one device family. For consortium builders, they offer something rare: a production-ready fabrication partner who can turn lab prototypes into reproducible wafer-level processes.

Notable projects

Highlights from their portfolio

  • MICROPRINCE
    X-FAB's only coordinator role — a pilot line project for micro-transfer-printing, demonstrating their ambition to lead foundry-scale process development.
  • ZeroAMP
    Explores nanomechanical switches for ultra-low-power logic and memory, including extreme environments (cryogenic and high temperature) — a significant departure from conventional semiconductor work.
  • YESvGaN
    Targets vertical GaN power transistors at silicon cost, signaling X-FAB's strategic move into wide-bandgap semiconductor manufacturing.
Cross-sector capabilities
Energy — GaN power electronics for efficient power conversionTransport — power semiconductors for electric vehicle invertersSpace — radiation-hard and extreme-temperature NEMS logicManufacturing — MEMS sensors and wafer-level integration for Industry 4.0
Analysis note: With only 4 projects and no early-period keywords available, the evolution analysis relies on project titles and dates rather than rich keyword data. X-FAB is a well-known foundry brand, but the H2020 portfolio captures only a slice of their full capabilities. The third-party role in YESvGaN suggests involvement without direct EC funding, which may understate their commitment to GaN.