If you are a packaging company dealing with counterfeiting of premium products — this project developed printed NFC inlays for anti-counterfeiting that were demonstrated in runs of 10,000 units on consumer packaging. The conductive inks and roll-to-roll process are designed for high-volume manufacturing, meaning you can add authentication to every package without retooling your production line.
Printed Electronics and Smart Labels Made Cheaper with Advanced Conductive Inks
Imagine printing electronic circuits the same way you print a newspaper — fast, on flexible rolls of material, and dirt cheap per unit. That's what NECOMADA figured out how to do. They developed special conductive inks and adhesives that let you print smart labels, NFC tags, and sensors onto packaging, appliances, and medical devices using existing high-speed printing equipment. Think of it as turning any product's packaging into a smart, connected surface.
What needed solving
Manufacturers adding smart features (NFC tags, sensors, EMI shielding) to packaging, appliances, and medical devices currently rely on traditional silicon-based electronics that are expensive at scale and hard to integrate into flexible or curved surfaces. The cost per unit makes it impractical to put smart labels on every package or embed connectivity into every appliance. Companies need a way to print electronics cheaply, at high speed, onto flexible materials they already use.
What was built
The project delivered customised conductive inks and flexible adhesives for high-speed roll-to-roll printed electronics, plus working demonstrators: 10,000-unit packaging runs with NFC anti-counterfeiting tags (both metal and consumer packaging), 200-unit home appliance demonstrators with EMI shielding, 200-unit healthcare supply chain monitors, and 1,000 consortium reference inlays.
Who needs this
Who can put this to work
If you are an appliance manufacturer looking to embed NFC connectivity and EMI shielding into your products — this project built a home appliances demonstrator with 200 pilot units on PET and metal substrates. The printed electronics approach replaces traditional wired components with flexible, lightweight alternatives that integrate directly into product housings.
If you are a pharmaceutical company struggling with supply chain monitoring and drug authentication — this project produced a healthcare demonstrator of 200 units specifically targeted at pharmaceutical supply chain tracking. The printed NFC tags can be embedded directly into packaging, giving you unit-level traceability without expensive silicon-based electronics.
Quick answers
What would it cost to integrate these printed electronics into our packaging line?
The project was specifically designed to reduce unit costs by using roll-to-roll printing instead of traditional electronics assembly. While exact per-unit pricing is not published, the 10,000-unit demonstration runs for both metal and consumer packaging suggest costs are already viable at mid-volume. Based on available project data, contact the consortium for current pricing benchmarks.
Can this scale to millions of units per year?
Yes, the entire project was built around high-volume roll-to-roll manufacturing on existing CPI pilot facilities. Demonstration runs reached 10,000 units for packaging applications, and the conductive inks and adhesives were specifically formulated for compatibility with high-speed printing platforms. The 13-partner consortium includes 9 industry players positioned to support scale-up.
Who owns the IP and how can we license the technology?
The consortium of 13 partners across 6 countries developed the IP collectively, coordinated by Centre for Process Innovation (CPI) in the UK. Licensing arrangements would need to be negotiated with the relevant consortium members — materials suppliers for inks and adhesives, and CPI for the integration process. Based on available project data, specific licensing terms are not publicly disclosed.
Is this compatible with our existing printing and packaging equipment?
The project was explicitly designed to work with existing high-speed roll-to-roll print lines, specifically building on CPI's pilot facilities. The conductive inks and flexible adhesives were formulated for compatibility with standard high-volume manufacturing platforms, minimizing the need for new capital equipment.
What regulatory approvals exist for using these materials in healthcare and food packaging?
The project produced demonstrators for healthcare (200 units) and consumer packaging (10,000 units), indicating the materials were developed with these regulated sectors in mind. Based on available project data, specific regulatory certifications are not detailed in the deliverables. You would need to confirm compliance status directly with the consortium.
How long would it take to go from evaluation to production?
The project ran from 2017 to 2019 and delivered working demonstrators at pilot scale. Since the technology was validated on existing roll-to-roll infrastructure, integration timelines depend mainly on your specific substrate and application requirements. The 9 industrial partners in the consortium can support technology transfer and production ramp-up.
Who built it
The NECOMADA consortium is unusually industry-heavy: 9 out of 13 partners (69%) come from industry, with zero universities — this is a commercialization-focused team, not a research exercise. The 13 partners span 6 countries (BE, DE, DK, ES, FI, UK) and cover the entire supply chain from materials suppliers and nano-particle producers to print equipment manufacturers, electronic device makers, and end users in packaging, apparel, and healthcare. CPI (Centre for Process Innovation) in the UK coordinates, bringing established pilot line facilities. The 4 research organizations provide formulation and materials expertise. With 3 SMEs in the mix, there is a blend of agile innovators and established industrial players positioned to move this technology toward market.
- CENTRE FOR PROCESS INNOVATION LIMITED LBGCoordinator · UK
- NANOGAP SUB-NM-POWDER SAparticipant · ES
- THOMAS SWAN & CO LIMITEDparticipant · UK
- HENKEL KGaAparticipant · DE
- BSH ELECTRODOMESTICOS ESPANA SAparticipant · ES
- TEKNOLOGISK INSTITUTparticipant · DK
- NXP SEMICONDUCTORS BELGIUM NVparticipant · BE
- HENKEL ELECTRONIC MATERIALS BELGIUMNVparticipant · BE
- PRAGMATIC SEMICONDUCTOR LIMITEDparticipant · UK
- TYOTERVEYSLAITOSparticipant · FI
Centre for Process Innovation (CPI), UK — a leading technology innovation centre for process manufacturing. Contact their printed electronics team.
Talk to the team behind this work.
Want an introduction to the NECOMADA consortium for licensing or technology transfer? SciTransfer can connect you with the right partner for your application — packaging, appliances, or healthcare.