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Organization

PRAGMATIC SEMICONDUCTOR LIMITED

UK SME manufacturing flexible, non-silicon semiconductor circuits for smart packaging, NFC, and IoT through modular production lines.

Technology SMEmanufacturingUKSMENo active H2020 projects
H2020 projects
6
As coordinator
2
Total EC funding
€3.0M
Unique partners
51
What they do

Their core work

Pragmatic Semiconductor develops flexible, thin-film semiconductor devices manufactured using non-silicon processes, enabling ultra-low-cost integrated circuits for applications like smart packaging and NFC-enabled products. Their core innovation is a "Factory-in-a-box" modular production line for manufacturing flexible integrated circuits at scale, as demonstrated through their FlexLogIC projects. They work across the value chain from metal oxide semiconductor design to additive manufacturing processes for electronics, collaborating with both research institutions and industrial partners to bring printed and flexible electronics from lab to production.

Core expertise

What they specialise in

Flexible integrated circuit manufacturingprimary
3 projects

FlexLogIC Phase 1 and Phase 2 focused on modular 'Factory-in-a-box' production lines for flexible ICs; NECOMADA addressed nano-enabled conducting materials for device applications.

Metal oxide semiconductor designprimary
2 projects

PING project explicitly listed 'Metal Oxide design' as a keyword, and INDEED explored innovative nanowire device design.

Printed and NFC electronicssecondary
1 project

PING project developed printed intelligent NFC game cards and packaging, demonstrating application of their semiconductor technology in consumer products.

Laser-based additive manufacturing for electronicssecondary
1 project

HIPERLAM project explored high-performance laser-based additive manufacturing techniques applicable to electronics fabrication.

Evolution & trajectory

How they've shifted over time

Early focus
Printed electronics and NFC applications
Recent focus
Scalable flexible IC manufacturing

Pragmatic Semiconductor's H2020 participation spans 2015–2017 in start dates, a relatively compressed window, so dramatic shifts are limited. Early projects (2015) focused on proving the concept — printed NFC applications in PING and securing Phase 1 SME funding for their Factory-in-a-box vision in FlexLogIC. Later projects (2016–2017) shifted toward scaling up: FlexLogIC Phase 2 received over EUR 1.6M to build the actual production line, while HIPERLAM, NECOMADA, and INDEED expanded into advanced materials and manufacturing processes that feed into their core flexible IC platform.

Pragmatic is moving from demonstrating printed semiconductor concepts toward industrial-scale production of flexible integrated circuits, making them increasingly relevant for partners needing high-volume, low-cost smart electronics.

Collaboration profile

How they like to work

Role: active_partnerReach: European15 countries collaborated

Pragmatic operates as both a project leader and an active consortium partner, with a roughly even split between coordinator and participant roles. With 51 unique partners across 15 countries from just 6 projects, they work in large, diverse consortia rather than small bilateral arrangements. This broad network suggests they are well-connected in the European flexible electronics ecosystem and open to new partnerships, though their SME status means they bring deep specialization rather than large-scale resources.

With 51 unique consortium partners spanning 15 countries across 6 projects, Pragmatic has built a remarkably wide European network for an SME. Their collaborations span research-intensive programs (MSCA, RIA) and innovation-focused ones (IA, SME instruments), connecting them to both academic and industrial partners.

Why partner with them

What sets them apart

Pragmatic Semiconductor occupies a rare niche as an SME that both designs and manufactures flexible semiconductors — most competitors in this space are either large foundries or university labs. Their FlexLogIC "Factory-in-a-box" concept addresses a critical gap: the ability to produce flexible ICs at industrial volumes without billion-dollar fab investment. For potential partners, this means access to a production-ready platform for embedding low-cost intelligence into everyday objects like packaging, labels, and cards.

Notable projects

Highlights from their portfolio

  • FlexLogIC
    Their flagship — progressed from SME Phase 1 feasibility (EUR 50K) to Phase 2 scale-up (EUR 1.6M), validating the modular flexible IC production line concept.
  • PING
    Demonstrated a concrete consumer application of their technology — printed intelligent NFC game cards — showing market readiness beyond pure research.
  • NECOMADA
    Positioned Pragmatic within a broader nano-materials consortium, expanding their expertise from device design into advanced conducting materials for next-generation electronics.
Cross-sector capabilities
Digital (smart packaging, NFC, IoT devices)Nanotechnology (metal oxide and nanowire semiconductors)Consumer goods (intelligent packaging and gaming)Healthcare (potential for low-cost flexible biosensors)
Analysis note: All 6 projects started within a narrow 2015–2017 window, limiting evolution analysis. No recent-period keywords were available, so trend assessment relies on project titles and funding progression. The company name and FlexLogIC project descriptions strongly indicate flexible semiconductor manufacturing, but detailed technical capabilities beyond what project titles reveal could not be confirmed from the data alone.
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