If you are an aerospace supplier struggling with bulky, heavy power electronics for electric actuation or environmental control systems — this project built converter prototypes using wide band-gap semiconductors with integrated double-sided cooling. The 3D packaging eliminates wire bonds, a common failure point, while the built-in health monitoring predicts remaining lifetime before failures happen. With 12 consortium partners including Siemens leading, this was designed for real aircraft conditions.
Compact Power Converters That Survive Extreme Heat in Aircraft and Rail
Every electric motor in an airplane or train needs a power converter — think of it as a smart electrical translator that controls how energy flows. The problem is these converters generate a lot of heat and need heavy cooling equipment, which adds weight and kills efficiency. I2MPECT used next-generation semiconductor materials that run cooler and lose less energy, then stacked components in clever 3D packages with cooling built right in. The result: power converters that are dramatically smaller and lighter, which is exactly what you need when every gram counts at 30,000 feet.
What needed solving
Aircraft and trains are going electric, but power converters — the devices that control electrical energy — are too heavy, too bulky, and fail too often in extreme heat. Heavy cooling systems eat up the weight savings that electric drives are supposed to deliver. Without lighter, more reliable power electronics, the promise of more-electric transportation stays stuck on paper.
What was built
The project delivered converter prototypes using wide band-gap semiconductors in 3D wire-bond-free packages with double-sided integrated cooling. They also developed active thermal management, lifetime testing methods, and health monitoring and prognosis capabilities for power electronics in harsh environments.
Who needs this
Who can put this to work
If you are a rail equipment manufacturer looking to reduce the size and weight of onboard power converters — this project developed modular power electronics that operate reliably in harsh thermal environments. The active thermal management and condition monitoring technology means fewer unplanned maintenance stops. The consortium included expertise across 4 countries with 6 industrial partners validating the approach for transportation applications.
If you are a power electronics company needing higher efficiency converters for demanding environments — this project demonstrated 3D device packaging with planar interconnects and double-sided cooling for wide band-gap semiconductors. The lifetime testing and health prognosis methods developed here can reduce warranty costs by catching degradation early. The technology was proven at prototype level with converter deliverables completed.
Quick answers
What would it cost to license or adopt this technology?
Based on available project data, specific licensing terms are not published. The project was coordinated by Siemens, a large industrial corporation, so commercial terms would need to be negotiated directly. The consortium included 6 industrial partners, suggesting multiple potential licensing paths depending on which component you need.
Can this scale to industrial production volumes?
The project delivered converter prototypes, which means it has been demonstrated but not yet mass-produced. With Siemens as coordinator and 50% of the consortium being industrial partners, the path to manufacturing scale is shorter than for purely academic projects. However, scaling 3D packaging with double-sided cooling to volume production would require further engineering.
What is the IP situation — who owns what?
As an EU-funded Research and Innovation Action with 12 partners across 4 countries, IP ownership typically follows Horizon 2020 rules where each partner owns what they generated. Siemens as coordinator likely holds key system-level IP. Specific licensing arrangements would need to be discussed with the relevant consortium partner.
How does this compare to conventional power converters?
Conventional power converters use silicon semiconductors with wire-bond connections, which limit operating temperature and create reliability weak points. I2MPECT used wide band-gap semiconductors in wire-bond-free 3D packages with integrated cooling on both sides, targeting higher power density and reliability specifically for harsh environments like aircraft.
Is this technology ready for deployment today?
The project ended in 2018 and delivered converter prototypes. The technology was demonstrated at prototype level, not commercial product level. Companies interested in deploying this would likely need further development and certification work, especially for aerospace applications where qualification cycles are long.
What about regulatory compliance for aviation?
Based on available project data, the project focused on technology demonstration rather than certification. Aviation power electronics must meet strict DO-160 and other airworthiness standards. The health management and prognosis capabilities developed in the project could support certification arguments for reliability, but formal qualification was outside the project scope.
Who built it
This is a strong, industry-driven consortium led by Siemens, one of the world's largest power electronics manufacturers. With 12 partners split evenly between 6 industrial players and 5 universities plus 1 research organization, the project had the right balance of scientific depth and commercial realism. The 4-country spread across Germany, France, the UK, and Switzerland covers Europe's main aerospace and power electronics hubs. The 50% industry ratio is higher than typical EU research projects, which signals that the results were designed with real manufacturing constraints in mind rather than being purely academic exercises.
- SIEMENS AKTIENGESELLSCHAFTCoordinator · DE
- UNIVERSITE LYON 1 CLAUDE BERNARDthirdparty · FR
- THE UNIVERSITY OF SHEFFIELDparticipant · UK
- AIRBUS OPERATIONS SASparticipant · FR
- INSTITUT NATIONAL DES SCIENCES APPLIQUEES DE LYONparticipant · FR
- K & S GMBH PROJEKTMANAGEMENTparticipant · DE
- DYNEX SEMICONDUCTOR LIMITEDparticipant · UK
- AIRBUS DEFENCE AND SPACE GMBHparticipant · DE
- EIDGENOESSISCHE TECHNISCHE HOCHSCHULE ZUERICHparticipant · CH
- ECOLE CENTRALE DE LYONthirdparty · FR
- CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE CNRSthirdparty · FR
- SAFRAN ELECTRICAL & POWERparticipant · FR
Siemens AG (Germany) — reach out to their Power Electronics or Aerospace division
Talk to the team behind this work.
Want an introduction to the I2MPECT team? SciTransfer can connect you with the right technical contact at the consortium. We handle the matchmaking so you get straight to the people who built this.