Both I2MPECT and MuSiCA relied on Dynex as the industrial hardware contributor, covering integrated converter modules and SiC-based aircraft power modules.
DYNEX SEMICONDUCTOR LIMITED
UK manufacturer of high-power SiC and IGBT semiconductor modules for transport, aerospace, and industrial power conversion.
Their core work
Dynex Semiconductor is a UK-based manufacturer of high-power semiconductor devices — IGBTs, thyristors, and power modules — used in demanding power conversion applications. In H2020, they contributed as an industrial partner bringing real device fabrication capability: not modeling or design consultancy, but actual hardware. Their work spans integrated power electronic converters for transport (I2MPECT) and advanced Silicon Carbide modules engineered specifically for aircraft (MuSiCA). They are one of very few European companies capable of developing and manufacturing the physical semiconductor components that go inside high-reliability power systems.
What they specialise in
MuSiCA (2020-2022) focused specifically on multi-level SiC modules with integrated gate drivers for aircraft applications.
MuSiCA introduced wire bond-free architecture and silver sintered interconnections — next-generation packaging techniques for thermal and reliability performance.
I2MPECT (2015-2018) addressed integrated and intelligent modular power electronic converter design for transport systems.
MuSiCA explicitly targets aircraft applications, signaling a deliberate move into the more demanding aerospace qualification space.
How they've shifted over time
In their first H2020 project (I2MPECT, 2015-2018), Dynex contributed to general-purpose modular power electronic converters for transport, with no published keywords — typical of a broad industrial partner role. By MuSiCA (2020-2022), their focus had sharpened considerably: the keywords reveal a company pushing the frontier of SiC packaging technology, specifically planar layouts, wire bond-free structures, and silver sintered interconnections that eliminate the failure modes of conventional wire-bonded modules. The trajectory is clear — from conventional silicon-based power modules toward high-performance SiC devices engineered for the extreme reliability demands of aviation.
Dynex is moving deliberately into high-reliability SiC power modules for aerospace and aviation, where their manufacturing depth gives them a credible industrial role that few European companies can fill.
How they like to work
Dynex joins as a specialist industrial partner rather than a project leader — both H2020 projects list them as participant, never coordinator. With 11 unique partners across 4 countries over just 2 projects, they work in moderately-sized consortia and bring a specific, hard-to-replace manufacturing capability rather than administrative leadership. They are the kind of partner you recruit to make a proposal credible: a real European semiconductor manufacturer who will produce the hardware the consortium needs.
Dynex has collaborated with 11 unique partners across 4 countries, concentrated in the European transport and aerospace research ecosystem. Their network is focused rather than broad — they engage with specific industrial and research consortia where power semiconductor hardware is a critical deliverable.
What sets them apart
Dynex is one of the very few European-based manufacturers of high-power semiconductor devices — most competitors in this space are Asian or American. This gives them a strategic value in EU-funded projects that require European supply chain compliance or defence-adjacent aerospace qualification. Their combination of in-house fabrication and demonstrated SiC module development makes them a rare hardware anchor in otherwise software- and simulation-heavy power electronics consortia.
Highlights from their portfolio
- I2MPECTTheir largest H2020 project by far (EUR 954,158), covering integrated modular power electronic converter systems — the foundational engagement that established their EU research participation.
- MuSiCATechnically the more advanced project, targeting multi-level SiC modules for aircraft with wire bond-free packaging — a direct signal of Dynex's push into aerospace-grade semiconductor manufacturing.