Imagine stacking highways on top of each other instead of spreading them across the countryside — that's what this project did with light circuits on a chip. By layering multiple light-guiding pathways in 3D instead of flat 2D, the team built optical switches and sensors that are dramatically smaller and cheaper. The main result is a 36-by-36 optical switch that flips in 20 billionths of a second and uses roughly 95% less power than today's electronic equivalents. They also squeezed an entire laser vibration sensor — normally a table-top instrument — onto a single chip.
Data centers and telecom networks burn enormous amounts of electricity on electronic switching equipment that generates heat and requires expensive cooling. Meanwhile, industrial vibration sensing still relies on bulky, expensive bench-top laser instruments that cannot be deployed in the field at scale. Both problems stem from the same root: current optical components are too large, too power-hungry, and too expensive to replace their electronic counterparts.
The project built a 3D photonic integration platform combining polymer (PolyBoard) and silicon-nitride (TriPleX) chip technologies. Key demonstrators include a 4×4 optical switch module validated through bench-top and system tests, and a control unit for a 2D optical phased array beam scanning system for an integrated Laser Doppler Vibrometer.
If you are a data center operator dealing with rising energy bills from electronic switching equipment — this project developed a 36×36 optical switch with 20 ns switching time that delivers power and cost savings of almost 95% compared to standard electronic solutions. That means dramatically lower cooling loads and electricity costs at scale.
If you are a sensing equipment manufacturer struggling to shrink laser-based measurement systems into compact packages — this project built an integrated Laser Doppler Vibrometer with a 2D optical phased array beam scanning system on a single chip. This replaces bulky bench-top setups with a chip-scale device, opening the door to embedded vibration sensing in vehicles and aircraft.
If you are an inspection services company needing portable, high-precision vibration measurement — this project developed an on-chip Laser Doppler Vibrometer with an external cavity laser with linewidth less than 1 kHz. That level of precision in a chip-scale package means field-deployable vibration analysis without expensive lab equipment.
The project objective states that the optical switching module can deliver power and cost savings of almost 95% compared to standard electronic solutions. Exact per-unit pricing is not published, but the massive reduction in power consumption and component count points to significantly lower total cost of ownership.
The platform combines two established photonic fabrication technologies — PolyBoard (polymer) and TriPleX (silicon-nitride) — both of which are already manufactured in foundry settings by consortium partners. The 3D stacking approach was specifically designed to increase integration density, which favors volume manufacturing.
As a publicly funded RIA project (EUR 3,993,285), IP is owned by the consortium partners. With 6 industry partners including 3 SMEs across 5 countries, licensing or technology transfer discussions would go through the coordinator or the specific partner holding the relevant IP. SciTransfer can facilitate introductions.
The 36×36 optical switch achieves a switching time of 20 ns (nanoseconds). The phase shifters and switches on the TriPleX platform operate at frequencies up to 50 MHz. These speeds far exceed what mechanical or thermal optical switches can deliver.
The project ran from 2018 to 2022 and produced working demonstrators including the 4×4 optical switch module tested with bench-top and system tests, plus a control unit for the 2D beam scanning system. Based on available project data, this is at the tested demonstrator stage, not yet a commercial product.
Photonic integrated circuits for telecom must meet standard industry certifications, but there are no unique regulatory barriers for this technology. The silicon-nitride and polymer materials used are well-established in the photonics industry. Specific compliance would depend on the end application.
The 3PEAT consortium is well-structured for technology transfer, with 6 out of 9 partners coming from industry (67% industry ratio) and 3 of those being SMEs. The partnership spans 5 countries (Germany, Greece, Israel, Italy, Netherlands), covering Europe's key photonics hubs. The coordinator is a Greek research institute, while the strong industry presence — including both established photonics companies and agile SMEs — suggests the technology was developed with commercial viability in mind. With EUR 3,993,285 in EU funding and a clear mix of fabrication know-how (PolyBoard, TriPleX platforms), the consortium has both the technical depth and the commercial motivation to move results toward the market.
The coordinator is a Greek research institute (EREVNITIKO PANEPISTIMIAKO INSTITOUTO SYSTIMATON EPIKOINONION KAI YPOLOGISTON). SciTransfer can help identify the right contact person and facilitate an introduction.
Want to explore licensing or integration of this photonic switching or sensing technology? SciTransfer can connect you with the right consortium partner for your specific application.
