CARL ZEISS SMT GMBH

Their core work

Carl Zeiss SMT is the semiconductor lithography division of the ZEISS Group, designing and manufacturing optical and EUV (extreme ultraviolet) lithography systems used to pattern the most advanced semiconductor chips in the world. Within H2020, they contribute precision optics, metrology, and lithography equipment expertise to Europe's flagship semiconductor node-shrink programs — from 7nm down to 2nm. Their work directly enables the continuation of Moore's Law by solving the optical and materials challenges at each new technology node.

What they specialise in

How they've shifted over time

Early H2020 work (2015–2018) focused on enabling 7nm and 5nm semiconductor nodes with emphasis on EUV lithography fundamentals — including resist chemistry and electron beam deposition through ELENA. From 2019 onward, the focus shifted sharply toward 3nm and 2nm integration challenges, with broader system-level concerns appearing: metrology, heterogeneous integration, DTCO/STCO, and system engineering. The trajectory shows a move from component-level optics toward full process integration for sub-3nm manufacturing.

Zeiss SMT is expanding from pure lithography optics into system-level semiconductor process integration, making them relevant for any consortium tackling next-generation chip manufacturing challenges beyond just patterning.

How they like to work

Carl Zeiss SMT operates exclusively as a participant — never coordinating — which is typical for a major industrial equipment supplier contributing proprietary technology to large European semiconductor consortia. With 117 unique partners across 20 countries, they sit at the center of Europe's semiconductor R&D network. Their consistent presence across sequential node-shrink projects (SeNaTe → TAKE5 → TAKEMI5 → TAPES3 → PIN3S → IT2 → ID2PPAC) indicates deep, long-term relationships with the same core group of semiconductor fabs, research institutes, and equipment makers.

Exceptionally well-connected with 117 unique consortium partners across 20 countries, placing them among the most networked semiconductor equipment companies in H2020. Their partnerships span the full European semiconductor ecosystem — from research institutes (likely imec, CEA-Leti, Fraunhofer) to fabs and other equipment suppliers.

What sets them apart

Carl Zeiss SMT is one of very few companies globally capable of producing the precision optics required for EUV lithography — the technology that makes sub-7nm chip manufacturing possible. In the European semiconductor R&D landscape, they are irreplaceable: no advanced node project can proceed without lithography and metrology equipment at this level. Their EUR 28.7M in EC funding across 8 projects reflects their strategic importance to Europe's semiconductor sovereignty agenda.

Highlights from their portfolio

• PIN3S
  Largest single EC contribution (EUR 5.9M) — piloting integration of 3nm semiconductor technology, representing a critical inflection point in Europe's advanced chip manufacturing ambitions.
• ID2PPAC
  Most recent and forward-looking project targeting the 2nm node with explicit focus on power-performance-area-cost optimization, signaling Zeiss SMT's role in defining next-generation manufacturing requirements.
• ELENA
  The outlier — a Marie Curie training network on nanofabrication chemistry (EUR 249K), showing investment in fundamental science and workforce development alongside their industrial pilotline work.