Semiconductor process equipment
8 European H2020 organizations list this as part of their work — 4 as their primary capability.
Most active in this area
- SOLMATES BV
Dutch SME manufacturing industrial-scale Pulsed Laser Deposition equipment for thin films used in photonics, 5G, and semiconductors.
“PIN3S targets 3nm semiconductor integration; SILENSE involves ultrasound sensor fabrication.”
SMENL9 projects - DEMCON LIFE SCIENCES & HEALTHEINDHOVEN B.V.
Dutch engineering firm building precision instruments and testing systems for medical devices, semiconductor equipment, and health technology applications.
“Third-party contributor to both SeNaTe (7nm technology) and TAPES3 (3nm semiconductor pilotline), indicating sustained involvement in advanced chip manufacturing equipment.”
PrimaryNL6 projects - ICOS VISION SYSTEMS NV
Semiconductor inspection and metrology specialist providing vision-based quality control for chip manufacturing, advanced packaging, and photonics integration.
“Contributed process equipment expertise to TAKEMI5 (5nm), R3-PowerUP (300mm pilot line), and ID2PPAC (2nm).”
BE5 projects - SIOUX TECHNOLOGIES BV
Dutch high-tech engineering firm specializing in intelligent motion control, mechatronics, and AI-driven industrial automation for precision equipment.
“Participated in PIN3S, a pilot integration project for 3nm semiconductor technology.”
NL4 projects - DEMCON INNOVATION & TECHNOLOGY B.V.
Dutch high-tech engineering firm providing mechatronic systems, production equipment, and prototyping across semiconductor, drone, and medical device domains.
“Contributed to TAPES3, a pilotline project targeting 3nm semiconductor manufacturing processes and equipment.”
NL4 projects - SUSS MICROTEC SOLUTIONS GMBH & CO KG
German SME manufacturing precision lithography and bonding equipment for semiconductor and graphene device fabrication at nanometer scale.
“Core contributor to SeNaTe (7nm technology) and TAPES3 (3nm semiconductor pilotline), providing manufacturing equipment and process know-how.”
PrimarySMEDE4 projects - SPTS TECHNOLOGIES LIMITED
UK semiconductor equipment manufacturer contributing etch and deposition process tools to European chip fabrication pilot lines.
“All three H2020 projects (PowerBase, InForMed, IT2) involve semiconductor fabrication processes where SPTS contributes equipment and process expertise.”
PrimaryUK3 projects - LAM RESEARCH AG
Global semiconductor equipment manufacturer contributing wafer processing tools to Europe's most advanced chip pilotline projects (7nm to 3nm).
“All three H2020 projects (SeNaTe, WAYTOGO FAST, TAPES3) involve advanced semiconductor process technology where Lam contributes equipment and materials expertise.”
PrimaryAT3 projects