Imagine satellites talking to each other using invisible beams of light instead of slow radio waves, like switching from a dial-up modem to fiber-optic internet in space. This technology shrinks the bulky equipment needed for these lasers so they can fit on tiny satellites. It's like putting a super-fast internet router into a tiny chip that can survive the vacuum of space.
Current satellite communication relies on radio frequencies that are slow and bulky. There is an urgent need for high-speed, low-power laser links that can fit on small satellites in massive constellations.
A Tbps-ready optical satcom backbone including the TeraBIX co-packaged silicon transceiver and StarCom multi-protocol optical terminals.
If you are a constellation operator dealing with slow data transfer between satellites — this project developed the StarCom terminal that enables Tbps-ready optical links. This allows for massive increases in bandwidth and lower cost-per-bit for data transport.
If you are a manufacturer dealing with the limited size and weight of Small Sats (<100kg) — this project developed co-packaged silicon transceivers in a chiplet form factor. This reduces the size and power needed to send high-resolution imagery back to Earth.
If you are a security firm dealing with the need for unhackable communication — this project developed hardware for quantum networks and encryption. This enables secure data relay across space-based backbones.
The system is designed for industrial volume manufacturing with a SWaP-C (Size, Weight, Power, and Cost) suitable for the LEO constellation market, specifically reducing the cost-per-bit for data transport.
Yes, the project utilizes additive manufacturing for freeform telescopes and a Digital Twin to optimize assembly, integration, and test (MAIT) for lean, mass-production processes.
The project features proprietary manufacturing technologies in mirror fabrication, PIC packaging, and metal 3D printing, alongside the TeraBIX co-packaged silicon transceiver.
It uses a 'chiplet form factor' for co-packaged optics, allowing the silicon transceiver to be integrated directly with electronics like ASICs and FPGAs.
Based on available project data, the project period runs from 2024-05-01 to 2026-04-30.
The project is highly streamlined, consisting of 2 partners, both of which are SMEs based in Ireland. This 100% industry ratio indicates a strong commercial drive and a lean structure focused on rapid product development rather than academic research.
Contact MBRYONICS LIMITED in Galway, Ireland
Contact us to explore licensing opportunities for TeraBIX chiplets.
