Imagine if computers could process information using waves, like ripples in a pond, instead of just pushing electricity through tiny wires. This method uses far less energy and doesn't heat up as much as current chips. The team is building a bridge that lets these wave-based systems talk to the standard electronics we already use today.
Current microelectronics are hitting a wall due to Moore's law, where increasing power density leads to overheating. This limits the performance of autonomous IoT devices that require high efficiency with ultra-low power.
A hybrid system comprising a YIG-based magnetic spin-wave chip, a CMOS Analog Periphery IC (APIC) for driving and readout, and a high-bandwidth RF interposer for packaging.
If you are a manufacturer dealing with short battery life in autonomous sensors — this project developed a hybrid spin-wave-CMOS system that reduces power consumption and optimizes performance per circuit area.
If you are a designer dealing with the physical limits of Moore's law and chip overheating — this project developed a roadmap to compete with CMOS in technology nodes below 1 nm.
If you are a provider dealing with the need for high-performance computing in tiny, power-constrained environments — this project developed a system using spin-wave majority gates to increase computing throughput.
Based on available project data, there is no specific pricing or unit cost mentioned; the project focuses on technical demonstration and TRL 5 development.
The project uses TSMC for manufacturing the CMOS APIC, indicating a path toward industrial fabrication, though it is currently at a demonstrator stage.
Based on available project data, specific licensing terms are not provided, but the project involves a consortium of 7 partners across 6 countries.
It uses a large bandwidth RF interposer to co-integrate the spin-wave circuit and a mixed-signal CMOS chip into a single package.
The project runs from 2022-12-01 to 2026-11-30, with second-generation chips taped out in early 2025.
The consortium is well-balanced for a deep-tech project, consisting of 7 partners from 6 countries. With an industry ratio of 29% (including 2 industrial partners and 1 SME), the project bridges the gap between academic research (2 universities, 3 research centers) and commercial manufacturing, evidenced by the use of TSMC for chip fabrication.
Contact INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM (imec) in Belgium.
Contact us to explore licensing opportunities for spin-wave computing architectures.
