Imagine a chip that acts like a smart sponge, using very little electricity while staying tough enough to survive the harsh radiation of space. Instead of relying on foreign tech, this project builds a complete European toolkit to make these efficient chips. It is like creating a local blueprint and factory system so Europe can make its own high-tech brains for cars and gadgets.
Europe lacks semiconductor autonomy and relies on foreign supply chains. Current chips often consume too much power or fail in extreme environments like space.
A reinforced FDSOI design ecosystem including a Semiconductor Intellectual Property (SIP) core and integrated digital, analog, and RF components.
If you are a radar system provider dealing with high power drain in vehicles — this project developed FDSOI technology that provides world-leading energy efficiency and high reliability for Advanced Driver Assistance Systems.
If you are a satellite manufacturer dealing with chip failure due to cosmic radiation — this project developed radiation-hardened FDSOI platforms that ensure high reliability in space environments.
If you are a wearable tech company dealing with short battery life — this project developed low-power semiconductor IP that extends the life of IoT devices and handsets.
The SOIL project has a total budget of 95.7 M€ funded by the CHIPS JU and participating states.
Yes, the project aims to accelerate industrial deployment and secure a resilient European value chain from material to system.
The project focuses on reinforcing the FDSOI design ecosystem by developing a Semiconductor Intellectual Property (SIP) core to support the supply chain.
The project runs for 36 months, from June 1, 2024, to May 31, 2027.
Based on available project data, FD-SOI is a simpler process that is compatible with bulk CMOS.
The consortium is heavily industry-driven, with 23 industrial partners (62% of the group) including 11 SMEs. Led by STMicroelectronics, the group spans 9 countries, indicating a strong commercial push to move FDSOI technology from the lab into the European supply chain.
Contact STMicroelectronics Crolles 2 SAS
Contact us to identify specific FDSOI IP licensing opportunities from the SOIL consortium.
