Imagine the brain of your phone needing to handle way more data without getting hot or draining the battery. This work creates new types of high-performance electronic chips that act like super-highways for data. It's like upgrading from a narrow country road to a multi-lane freeway for wireless signals and satellites.
Current semiconductor technology cannot meet the combined demand for higher transmission power and lower energy consumption required by 6G and satellite networks. This leads to overheating and inefficient data speeds in next-gen hardware.
Industrialized SiGe BiCMOS and RF GaN semiconductor technologies, including 'FEM' modules and 3D integrated packaging for mm-wave antennas.
If you are a network provider dealing with the energy demands of 6G rollout — this project developed SiGe BiCMOS and RF GaN technologies that provide higher transmission power and better energy efficiency. This allows for faster network access and trunks.
If you are a satellite manufacturer dealing with signal integrity and heat in space — this project developed 3D integration and Active Mold Packaging for mm-wave antennas. This simplifies RF systems and improves heat dissipation.
If you are a defense contractor dealing with radiation interference in Earth observation networks — this project developed chips with verified radiation immunity. This ensures reliable device performance in harsh orbital environments.
Based on available project data, specific pricing or cost per unit is not provided; however, the project includes environmental and economic impact assessments to evaluate viability.
Yes, the project is led by STMicroelectronics and involves 22 industry partners, specifically aiming to industrialize SiGe BiCMOS and RF GaN technologies.
Based on available project data, specific licensing terms are not listed, but the consortium covers the entire value chain from laboratories to manufacturers.
The project developed 'FEM' modules and new assembly techniques like Active Mold Packaging to solve RF signal integrity and heat dissipation issues.
The project runs from 2022-12-01 to 2026-11-30, suggesting that industrial validation via 10 demonstrators is ongoing through 2026.
The consortium is heavily industry-driven, with 22 industrial partners (50% of the total) and 11 SMEs, indicating a strong push toward commercialization. Led by a global semiconductor giant (STMicroelectronics) and including 44 partners across 8 countries, the group spans the entire value chain from academic research (18 universities) to final manufacturing.
Contact STMicroelectronics France regarding SiGe BiCMOS55X and RF GaN developments.
Contact us to identify which of the 10 demonstrators matches your hardware roadmap.
