Imagine the brain and voice of a satellite needing to be smaller, faster, and tougher to survive the harsh vacuum of space. This work creates a specialized 'recipe' for making chips from Gallium Nitride that can handle extreme heat and high frequencies. It's like upgrading a satellite's radio from a basic walkie-talkie to a high-speed fiber-optic equivalent that works in orbit.
Satellite operators struggle with high power consumption and heat dissipation in high-frequency payloads, while relying on non-European supply chains for critical GaN components.
A European GaN on SiC foundry process and a demonstrator SSPA including optimized PAs, LNAs, and switches for Q/V band frequencies.
If you are a satellite prime contractor dealing with high power consumption and heat in LEO/GEO payloads — this project developed a European GaN on SiC foundry process that increases thermal drain to the heat sink and reduces parasitic losses.
If you are an equipment manufacturer dealing with the need for high-frequency components beyond Q-band — this project developed efficient SSPA, LNA, and switch devices to create robust RF front-ends.
If you are a provider dealing with the complexity of dissipating heat in antennas with many active units — this project developed at least 3 PA design concepts to improve efficiency and reduce extra power demand.
Based on available project data, no specific pricing or cost figures are provided.
Yes, the project involves an industrial foundry (UMS) and an epitaxy manufacturer (SweGaN) to secure a European supply chain.
Based on available project data, the specific licensing terms are not mentioned, but the project involves a consortium of 9 partners including industrial foundries and universities.
The project focuses on MMIC design and packaging techniques for space use, culminating in an SSPA demonstrator tested under space environmental conditions.
The project period runs from 2022-12-01 to 2026-11-30.
The consortium is heavily weighted toward industrial application, with a 67% industry ratio (6 companies). It creates a complete vertical value chain: from raw material (SweGaN epitaxy) and fabrication (UMS and FBH foundries) to system integration (SENER) and end-user requirements (ADS and TAS). This structure minimizes the gap between lab research and market deployment.
Contact SENER TAFS SA in Spain
Contact us to explore licensing opportunities for European GaN-on-SiC space components.
