Imagine a computer chip that can change its own internal wiring after it's already been built. This allows a sensor to switch its behavior on the fly to better detect things like cancer markers or air quality. It's like having a multi-tool that reshapes itself to fit the exact job it's doing at that moment.
Current sensors are often rigid and cannot adapt to changing environments or different target molecules after manufacturing. This forces companies to design and produce multiple different chips for different applications, increasing R&D costs and waste.
A reconfigurable platform featuring a tunable analog front-end and a sensor transducer. A physical test-chip using 22nm FDSOI technology has been taped out.
If you are a medical device company dealing with the difficulty of detecting colorectal cancer biomarkers — this project developed a reconfigurable sensor transducer that can be integrated into standard chips to improve detection accuracy.
If you are an automotive supplier dealing with sensors that fail in changing environmental conditions — this project developed a tunable analog front-end that adapts at run-time to reduce power consumption and improve signal quality.
If you are a chip designer dealing with the high cost of creating different chips for every single sensor type — this project developed a reconfigurable platform using 22nm CMOS technology that allows one chip to serve multiple purposes.
Based on available project data, specific pricing or cost-per-unit information is not provided; however, the use of standard 22nm CMOS processes suggests a path toward cost-effective mass production.
Yes, the technology is designed to be co-integrated into conventional CMOS architectures and has already been brought to tape-out using 22nm FDSOI processing technology with GlobalFoundries.
Based on available project data, specific licensing terms are not listed, but the project involves 9 partners across 5 countries, including academic and research institutions.
The RFETs are designed as add-ons to classical scaled CMOS processes, meaning they can be integrated into existing 22nm European processing technologies.
The project is active from 2024-01-01 to 2027-12-31.
The consortium is heavily research-driven, consisting of 9 partners from 5 countries (AT, CH, DE, FR, NL). With 6 universities and 2 research centers, the academic weight is high, while industrial participation is low at 11% (1 industry partner and 1 SME). This suggests the project is currently focused on technical validation and IP generation rather than immediate commercial rollout.
Contact NAMLAB GGMBH in Germany for technical specifications on RFET integration.
Contact us to bridge the gap between this 22nm prototype and your industrial sensor roadmap.
