If you are a vehicle OEM dealing with the high cost and fragility of rotating sensors — this project developed a true solid-state LiDAR that uses a system-on-chip design to lower costs and increase robustness.
Low-Cost Solid-State LiDAR for Mass Automotive Production and Industrial Safety
Imagine a camera that doesn't just see colors, but feels the exact distance of everything around it using light. Instead of using spinning parts that can break or wear out, this system uses a single computer chip to do the work. It's like moving from a bulky old record player to a sleek digital MP3 player for 3D sensing.
What needed solving
Traditional LiDARs are too expensive and fragile for mass automotive use because they rely on moving parts and complex calibration. This creates a barrier for OEMs wanting to implement high-resolution 3D sensing at scale.
What was built
A true solid-state LiDAR system-on-chip and a novel 3D measurement algorithm that handles reflectors in the field of view.
Who needs this
Who can put this to work
If you are a robotics provider dealing with harsh industrial environments where moving parts fail — this project developed a sensor with zero moving parts that ensures high reliability in 3D measurement.
If you are a system integrator dealing with the need for high-resolution traffic monitoring — this project developed a sensor generating 8D environmental data to guarantee superior detection reliability.
Quick answers
How does this solution impact the cost of LiDAR systems?
The project uses a full semiconductor design and a system-on-chip approach to keep costs low, eliminating the need for active alignment and custom imagers.
Is this technology ready for industrial scale production?
Yes, the project developed process designs for assembly and production, including high-efficiency assembly steps and IQC processes to minimize calibration.
What is the IP or licensing status of the technology?
Based on available project data, the project has invented a novel solid state line projector and a breakthrough 3D measurement algorithm, though specific licensing terms are not listed.
How does it integrate into existing vehicle architectures?
It is designed as a complete system-on-chip, which meets the specific size and power consumption requirements demanded by automotive OEMs.
What is the timeline for deployment?
The project period ran from 2022-11-01 to 2024-10-31, focusing on system design and validation in the first two years.
Who built it
The project is led by a single Belgian SME, Xenomatix, which maintains 100% industry ratio. This lean structure suggests a highly focused commercial drive, utilizing a team of technical leads and customer-facing stakeholders to ensure the product meets the 'voice of the customer'.
Contact Xenomatix in Belgium for semiconductor-based LiDAR integration
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