If you are a hardware manufacturer dealing with the massive size and high cost of quantum devices — this project developed a universal PIC platform that enables wafer-level manufacturing to reduce size and cost.
Universal Quantum Photonics Chip Platform for Scalable Computing and Sensing
Imagine trying to build a super-advanced computer, but the parts are as big as a room and cost a fortune. This project shrinks those massive quantum components onto a tiny chip, similar to how a giant room of vacuum tubes became a modern processor. By using a special aluminum-oxide material, they can handle a wide range of light colors to make these devices smaller, cheaper, and easier to mass-produce.
What needed solving
Current quantum devices are too large, expensive, and difficult to scale, preventing them from moving out of the lab and into commercial markets.
What was built
A universal Al2O3 integrated photonics platform and an open PDK containing building blocks like tunable lasers and single photon detectors.
Who needs this
Who can put this to work
If you are a sensor developer dealing with the lack of portable, high-accuracy clocks — this project developed an atomic clock based on Yb+ ions for quantum sensing.
If you are an infrastructure provider dealing with scalability issues in quantum networks — this project developed a source of GKP states for quantum processing to enable next-generation communications.
Quick answers
How does this project reduce the cost of quantum devices?
It utilizes wafer-level manufacturing based on microfabrication technologies to move away from bulky, expensive setups toward integrated circuits.
Can this be produced at an industrial scale?
Yes, the project focuses on a PIC platform that allows for wafer-level manufacturing to ensure scalability and a full European supply chain.
What is the IP or licensing model for the developed components?
The project is developing an open PDK (Process Design Kit) to group quantum building blocks and accelerate innovation from idea to manufacture.
How is the technology integrated into existing systems?
The project investigates programmable ASICs and specific packaging and assembly technologies to ensure the PICs can be integrated into functional systems.
What is the timeline for the development of these demonstrators?
The project runs from 2024-01-01 to 2027-12-31, with initial design requirements for demonstrators completed in the first 18 months.
Who built it
The consortium is highly balanced for commercialization, featuring a 50% industry ratio with 6 industrial partners, including 4 SMEs. This mix of 5 universities and 1 research center across 6 European countries suggests a strong pipeline from academic research to industrial application, specifically aimed at securing a European supply chain.
Contact Universiteit Twente regarding the open PDK for quantum PICs
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