If you are a 5G infrastructure provider dealing with congestion in radio access networks — this project developed a 1.6 Tbit/s optical transceiver that ensures guaranteed latency and jitter for fronthaul applications.
Ultra-Fast Optical Switching for High-Capacity Data Centers and 5G Networks
Imagine a massive city intersection where traffic lights change instantly to prevent any jam, no matter how many cars arrive. This technology does that for data, using light instead of electricity to route information. It acts like a smart switchboard that can instantly rewire itself to send data where it is needed most without any delay.
What needed solving
Current data center interconnects are static and cannot handle the bursty, high-capacity demands of AI and autonomous systems, leading to over-provisioned resources and high latency.
What was built
A high-speed optical switch fabric and 1.6 Tbit/s transceivers integrated into a heterogeneous fanout wafer-level package.
Who needs this
Who can put this to work
If you are a data center operator dealing with inefficient resource allocation and high energy use — this project developed a space-and-wavelength switch fabric that allows for memory disaggregation and flexible bandwidth steering.
If you are a network developer dealing with the extreme latency requirements of autonomous driving — this project developed time-deterministic optical switching that eliminates the trade-off between flexibility and guaranteed delivery.
Quick answers
How does this reduce the cost per port?
The project utilizes silicon photonics and semiconductor packaging compatible with high-volume manufacturing to ensure a low cost per port.
Is this technology ready for industrial scale?
Yes, the project uses a 200mm reconstructed wafer platform and CMOS-compatible processes designed specifically for high-volume manufacturing.
What is the IP or licensing status?
Based on available project data, specific licensing terms are not listed, but the project involves 8 partners across 7 countries developing custom ICs and packaging processes.
How does it integrate with existing electronic hardware?
It uses a heterogeneous fanout wafer-level package and an optical redistribution layer to provide a scalable interface between optical switches and electronic compute or memory resources.
When will the first modules be available?
The project period runs until February 28, 2027, with the goal of delivering first fully manufactured modules as a validated deliverable.
Who built it
The consortium is heavily industry-driven with a 62% industry ratio, comprising 5 industrial partners and 2 SMEs. This strong commercial presence, combined with 3 academic and research institutions across 7 countries, indicates a clear focus on translating laboratory photonics into manufacturable products.
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