Imagine trying to connect tiny, expensive light-based chips using a complex and costly assembly process. This project creates a special 'motherboard' made of polymer that lets these chips snap into place easily, much like how Lego bricks fit together. It replaces expensive manual alignment with a standardized system that makes high-tech light processors much cheaper to build.
Photonic integrated circuits suffer from high packaging complexity and low fabrication yields, making them too expensive for mass adoption. Current methods treat electrical connections as a secondary issue, creating a bottleneck as the number of electrical IOs increases.
A polymer-based Electro-Optic PCB (EOPCB) motherboard that integrates Si3N4 chiplets, InP components, and electronic ICs. This includes a THz spectrometer and quantum processors (16x16 and 24x24).
If you are a plastics manufacturer dealing with quality control bottlenecks — this project developed an optoelectronic FMCW THz spectrometer that uses antenna arrays for non-destructive testing. This allows for faster, integrated sensing of material properties.
If you are a quantum hardware developer dealing with the high cost of photonic packaging — this project developed a 24x24 quantum processor with integrated squeezed light sources. This reduces production costs of photonic modules by at least 10x.
If you are an optical component manufacturer dealing with scalability and fabrication yield issues — this project developed an Electro-Optic PCB (EOPCB) motherboard. It enables the integration of Si3N4 chiplets and InP components in one step.
The project aims to reduce the production costs of photonic modules by at least 10x through the use of a polymer-based motherboard and wafer-scale compatible processes.
Yes, the technology is designed to be compatible with wafer-scale processes and uses standard size chiplets and interfaces to provide excellent scalability.
Based on available project data, specific licensing terms are not provided, but the project involves 6 industrial partners, including 5 SMEs, suggesting a strong commercialization focus.
The system uses electronic IC co-packaging on the same EOPCB, which simplifies packaging and allows for driver and read-out electronics to be integrated directly.
The project period runs from 2023-01-01 to 2027-03-31, with significant progress on prototypes reported up to month 30.
The consortium is heavily industry-driven, with 67% of the 9 partners being industrial entities (6 companies), 5 of which are SMEs. This high industry ratio, combined with partners from 4 countries (DE, EL, ES, NL), indicates a strong focus on commercial viability and market entry rather than purely academic research.
Contact EREVNITIKO PANEPISTIMIAKO INSTITOUTO SYSTIMATON EPIKOINONION KAI YPOLOGISTON in Greece
Contact us to connect with the POLYNICES consortium for licensing and integration partnerships.
