PLASMOfab · Project

Faster, Smaller Photonic Chips for Data Centers and Medical Diagnostics

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Imagine squeezing light through channels even smaller than what today's fiber optics allow — that's what plasmonics does. PLASMOfab figured out how to build these ultra-tiny light-guiding structures using the same factory equipment that already makes your phone's processor. They proved it works for two real things: a medical sensor chip that detects inflammation markers in blood without chemical labels, and a data transmission chip running at 100 gigabits per second. The key breakthrough is that all of this can be made on existing chip production lines, not in specialized labs.

By the numbers

100 Gb/s

Transmitter data rate achieved in prototype

Consortium partners across industry and academia

Countries represented in consortium

Demo deliverables completed (transmitter + biosensor prototypes)

SME partners involved in commercialization path

The business problem

What needed solving

Data centers need faster optical interconnects in smaller packages with lower power consumption, but today's photonic chips require expensive specialized manufacturing separate from standard electronics. Meanwhile, medical diagnostics companies need compact, low-cost biosensors that can detect multiple biomarkers without complex chemical labeling steps. Both markets are bottlenecked by the inability to combine optical and electronic components on a single chip using existing production infrastructure.

The solution

What was built

The project built and experimentally validated two wafer-scale prototypes: a compact multichannel biosensor chip for label-free inflammation marker detection, and a 100 Gb/s NRZ optical transmitter chip with integrated SiGe driving electronics. Both were fabricated at commercial CMOS foundries using standard metals (Aluminum, Titanium Nitride, Copper), plus an EDA software design kit library for third-party chip design.

Audience

Who needs this

Optical transceiver manufacturers (e.g., companies making 100G+ pluggable modules for data centers)Point-of-care diagnostics companies developing compact blood biomarker detection devicesCMOS foundries looking to add photonic integrated circuit services to their offeringTelecom equipment vendors needing high-speed, low-energy optical componentsBiosensor startups seeking scalable, low-cost manufacturing for label-free detection platforms

Business applications

Who can put this to work

Medical Diagnostics

mid-size

Target: Point-of-care diagnostics device manufacturers

If you are a diagnostics company struggling with bulky, expensive lab equipment for detecting inflammation biomarkers — this project developed a compact, label-free biosensor chip with multichannel capabilities that can detect multiple markers simultaneously on a single wafer-scale chip. Because it uses standard CMOS manufacturing, it could dramatically cut your per-unit sensor cost compared to custom optical components.

Data Center Hardware

enterprise

Target: Optical transceiver and datacom equipment manufacturers

If you are a transceiver manufacturer under pressure to deliver higher bandwidth in smaller form factors — this project built and tested a 100 Gb/s NRZ transmitter prototype that integrates the optical modulator and driving electronics on a single monolithic chip. This eliminates the need for separate packaging of photonic and electronic components, reducing both size and energy consumption.

Semiconductor Foundries

enterprise

Target: CMOS foundries looking to expand into photonics services

If you are a semiconductor foundry wanting to offer photonic integrated circuit manufacturing without retooling your production line — this project validated wafer-scale fabrication of plasmonic-photonic chips at commercial CMOS fabs using standard metals like Aluminum, Titanium Nitride, and Copper. The project also developed an EDA software design kit library to support a fabless design ecosystem around your manufacturing capability.

Frequently asked

Quick answers

What would it cost to license or adopt this technology?

The project does not publish licensing fees or per-chip costs. However, a core value proposition is cost reduction through standard CMOS-compatible manufacturing — meaning existing production lines can be used without major capital investment in new equipment. Contact the consortium for licensing terms.

Can this be manufactured at industrial scale?

Yes — wafer-scale fabrication was explicitly demonstrated at commercial CMOS fabs, which is the standard for volume semiconductor manufacturing. The project developed both a transmitter chip and a biosensor chip at wafer scale, confirming production scalability.

What is the IP situation — can I license this?

The consortium of 11 partners across 7 countries includes 4 industry partners and 3 SMEs, which typically means shared IP with commercial licensing possible. The project also produced an EDA design kit library, which suggests intent to enable third-party adoption. Specific IP terms would need to be negotiated with the coordinator.

How fast is the data transmitter compared to current products?

The prototype demonstrated 100 Gb/s NRZ transmission, which was competitive with high-end optical interconnects at the time. The key differentiator is not raw speed alone but that the modulator and SiGe driving electronics are integrated on a single monolithic chip, reducing size, energy, and assembly cost.

How sensitive is the biosensor compared to existing solutions?

The project aimed for record-high sensitivity by combining plasmonic sensors with electrical contacts, Si3N4 photonics, and microfluidics for label-free inflammation marker detection. Based on available project data, experimental evaluation of biosensor prototypes was completed, but specific sensitivity numbers are not published in the dataset reviewed.

What is the timeline to get this into a product?

The project ended in December 2018 with working prototypes validated at wafer scale. Moving from validated prototype to commercial product typically requires 2-4 years of engineering, certification, and market development. The EDA design kit developed by the project could accelerate adoption by third parties.

Consortium

Who built it

The PLASMOfab consortium brings together 11 partners from 7 countries (Austria, Switzerland, Germany, Greece, France, Israel, Netherlands), with a healthy 36% industry ratio including 3 SMEs. The mix of 4 university groups, 2 research organizations, and 4 industry players covers the full chain from fundamental plasmonic research to CMOS fabrication and commercial chip design. With partners spanning major European semiconductor and photonics hubs, the consortium is well-positioned for technology transfer — particularly through the SMEs that can move faster to market than large institutions. The coordinator, Aristotle University of Thessaloniki, led the academic research while industry partners handled fabrication validation at commercial fabs.

ARISTOTELIO PANEPISTIMIO THESSALONIKISCoordinator · EL
AIT AUSTRIAN INSTITUTE OF TECHNOLOGY GMBHparticipant · AT
UNIVERSITE DIJON BOURGOGNEparticipant · FR
AMS-OSRAM AGparticipant · AT
GESELLSCHAFT FUR ANGEWANDTE MIKRO UND OPTOELEKTRONIK MIT BESCHRANKTERHAFTUNG AMO GMBHparticipant · DE
EIDGENOESSISCHE TECHNISCHE HOCHSCHULE ZUERICHparticipant · CH
MELLANOX TECHNOLOGIES LTD - MLNXparticipant · IL
KEYSIGHT TECHNOLOGIES DEUTSCHLAND GMBHparticipant · DE
CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE CNRSthirdparty · FR
SYNOPSYS SOFTWARE NETHERLANDS BVparticipant · NL
UNIVERSITAT DES SAARLANDESparticipant · DE

How to reach the team

Aristotle University of Thessaloniki (Greece) — search for PLASMOfab project coordinator in the university's photonics or electronics department

Order a report on this consortium See ARISTOTELIO PANEPISTIMIO THESSALONIKIS profile →

Next steps

Talk to the team behind this work.

Want to explore licensing PLASMOfab's CMOS-compatible plasmonic technology for your products? SciTransfer can connect you with the right consortium partner for your use case.

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