Imagine if designing a complex light-based computer chip was as easy as updating software on a laptop. Instead of spending a year building a custom chip from scratch, developers can use a versatile 'starter kit' to route light and test ideas in weeks. It's like moving from building a custom circuit board by hand to using a programmable Lego set for light.
Developing custom photonic chips is currently too slow and expensive, often taking over a year to prototype a single concept. There is a lack of standardized, programmable hardware that allows developers to test photonic circuits without full fabrication cycles.
A three-tier platform consisting of a 200 mm wafer-scale fabrication flow, modular packaging with driver electronics, and a software-controlled programmable photonic processor.
If you are a data center provider dealing with bandwidth bottlenecks—this project developed a programmable photonic processor that optimizes light flow for communication. This allows for faster data routing and reduced hardware iteration time.
If you are a hardware manufacturer dealing with complex mm-wave wireless beamforming—this project developed a wafer-scale platform with MEMS actuators. This enables precise control of signals to improve wireless connectivity.
If you are a sensor developer dealing with calibration drift—this project developed on-chip gas cells that act as an absolute calibration reference. This ensures high accuracy for tunable lasers used in sensing applications.
Based on available project data, specific pricing or cost figures are not provided, though the project aims to lower the adoption threshold for developers.
Yes, the platform is based on 200 mm wafer-scale silicon photonics and includes a migration path to a European industrial 200 mm foundry.
Based on available project data, specific licensing terms are not mentioned, but the project provides a design kit and a software interface for users.
The multipurpose programmable photonic processor reduces prototyping time for new concepts from more than a year to weeks.
The second tier provides modular packaging processes and driver electronics, which are integrated into a design kit to simplify connectivity.
The consortium is heavily weighted toward industrial application, with 6 industry partners (55% ratio) and 11 total partners across 8 countries. This strong industry presence, combined with the involvement of the IMEC coordinator, suggests a high focus on commercial viability and a clear path toward 200 mm foundry migration.
Contact INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM (IMEC) in Belgium
Contact us to identify licensing opportunities for the PHORMIC design kit.
