Imagine trying to push massive amounts of data through a tiny straw; usually, the signal gets stuck or distorted. This project creates a high-tech 'super-highway' on a chip by combining different materials that handle light and electricity better than ever. It's like building a Swiss Army knife for data, putting everything needed for ultra-fast signals into one tiny package.
Current microwave photonic systems suffer from high signal loss and impedance mismatches due to traditional bonding methods. Additionally, there is a lack of standardized design tools for frequencies exceeding 100 GHz.
A Process Design Kit (PDK) and Assembly Design Kit (ADK) for >100 GHz, along with hybrid integrated chips combining LNOI, InP, and YIG materials.
If you are a network provider dealing with signal bottlenecks in 6G antennas — this project developed a process design kit for frequencies >100 GHz that enables ultra-high-speed data transmission. This allows for denser, faster wireless networks with less interference.
If you are a space tech company dealing with bulky hardware and signal loss in orbit — this project developed hybrid integrated photonic circuits that combine InP, LNOI, and YIG. This reduces the size of communication systems while maintaining high-speed performance.
If you are a quantum computing firm dealing with the need for precise light control and isolation — this project developed integrated magneto-optics isolators and acousto-optics modulators. These components ensure signals move in one direction without noise, critical for quantum stability.
Based on available project data, specific pricing or production costs are not mentioned.
The project focuses on creating a Process Design Kit (PDK) and Assembly Design Kit (ADK), which are the essential blueprints required for industrial-scale manufacturing of these chips.
Based on available project data, the IP arrangement is not specified, though the consortium includes 6 industrial partners and 4 SMEs who likely share the developed toolkits.
The project specifically developed the co-integration of electronic SiGe chips with photonic circuits to enable ultra-speed operations.
The project period runs from 2022-09-01 to 2026-08-31, suggesting that final prototypes and toolkits will be ready by late 2026.
The consortium is heavily weighted toward commercialization, with a 43% industry ratio consisting of 6 industrial partners and 4 SMEs. Led by Thales, a major defense and security player, the group balances academic research (4 universities, 4 research centers) with practical application, ensuring the resulting PDKs and prototypes are aligned with market needs in telecom and space.
Contact Thales (France) regarding the microwave photonics PDK
Contact us to connect with the PATTERN consortium for early access to the 100 GHz PDK.
