Imagine taking a super-thin layer of carbon, like a piece of digital cling-wrap, and printing it precisely onto computer chips. This project finds a way to 'sticker' these materials onto wafers without damaging them or using messy chemicals. It turns bulky, expensive optical equipment into tiny, efficient chips that can 'see' better and faster.
Integrating 2D materials like graphene into silicon chips usually causes defects and requires disruptive processing. This makes high-performance sensors too expensive and bulky for mass-market industrial use.
Two additive transfer technologies: semi-dry transfer for wafer-scale integration and Laser Digital Transfer (LDT) for precise pixel placement. These were used to create graphene-based photodetectors and modulators.
If you are a drone manufacturer dealing with bulky mapping hardware — this project developed a miniaturized LiDAR with graphene detectors that provides sub-0.1 mm resolution. This allows for high-resolution geo-mapping with a significantly reduced system footprint.
If you are a plant operator dealing with expensive and slow leak detection — this project developed a multi-sensor PIC for greenhouse gas sensing. It enables real-time monitoring with detection limits around 50 ppm integrated into IoT networks.
If you are a medical imaging company dealing with bulky bulk optics in OCT systems — this project developed graphene-enhanced Polarization Diversity Receivers. These chips offer improved resolution and bandwidth, simplifying assembly by reducing alignment steps.
Based on available project data, companies will be able to offer PIC-based components with more than 50% reduced cost.
Yes, the project introduces direct wafer-scale integration and Laser Digital Transfer to enable integration within Si foundries without disrupting process lines.
Based on available project data, the project focuses on additive manufacturing techniques for 2D materials integration, though specific licensing terms are not listed.
The project aims for PIC-based components with up to 6x lower power consumption.
The project targets widespread adoption leading to revenues and job creation by 2030.
The consortium is heavily industry-driven, with 75% of the 12 partners being industrial entities, 8 of which are SMEs. This strong industrial presence across 9 countries suggests a high focus on commercial viability and a direct path to market integration within existing Si foundries.
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Contact us to connect with the 2D material integration experts in this consortium.
