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NeuroSoC · Project

Ultra-Low Power AI Chips for Smart Edge Devices using In-Memory Computing

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Imagine if a computer's brain could think and remember in the same spot instead of constantly moving data back and forth, which wastes energy. This project builds a chip that does exactly that using a special type of memory that acts like a neural network. It's like replacing a slow courier service between a warehouse and a desk with a desk that has everything built right into the surface.

By the numbers
28nm
FD-SOI technology node
1-5
Current state-of-the-art power efficiency (TOPS/w)
1
Current state-of-the-art power density (TOPS/mm2)
The business problem

What needed solving

Edge AI devices are currently limited by a trade-off between computing power and energy consumption. Existing chips are either too power-hungry or lack the maturity for mass production at low cost.

The solution

What was built

A multiprocessor System on Chip (SoC) prototype in 28nm FD-SOI technology featuring an analog in-memory neural processing unit and RISC-V microprocessor.

Audience

Who needs this

Semiconductor companiesEdge AI hardware startupsAutomotive electronics suppliersIndustrial IoT sensor manufacturers
Business applications

Who can put this to work

Consumer Electronics
enterprise
Target: Wearable device manufacturer

If you are a wearable device manufacturer dealing with short battery life due to AI processing — this project developed a 28nm FD-SOI chip that integrates memory and processing. This reduces the energy needed for AI tasks, allowing devices to run longer on a single charge.

Automotive
mid-size
Target: ADAS sensor provider

If you are an ADAS sensor provider dealing with the need for instant, safe decision-making at the edge — this project developed a functional safe and secure SoC. It provides low-latency AI processing directly on the chip to improve reaction times for safety systems.

Industrial IoT
SME
Target: Smart factory equipment maker

If you are a smart factory equipment maker dealing with high costs of deploying powerful AI in remote sensors — this project developed a mass-production compatible PCM technology. This allows for high-performance AI in low-cost, energy-constrained hardware.

Frequently asked

Quick answers

What is the expected cost or price of this technology?

Based on available project data, specific pricing is not listed, but the project focuses on using a mature PCM technology to ensure a path compatible with mass volume production and cost.

Can this be produced at an industrial scale?

Yes, the project leverages STMicroelectronics' high-density embedded PCM cell process, which is described as a qualified and mature technology for embedded use in the industry.

How is the IP and licensing handled?

Based on available project data, the project involves the design of a modular IP implementing a Neural Processing Unit (NPU), though specific licensing terms are not provided.

How does this integrate with existing systems?

The system integrates an analog IMC-based unit with a digital processing subsystem and host subsystems based on an enhanced RISC-V microprocessor implementation.

What is the timeline for market availability?

The project period runs from 2022-09-01 to 2027-02-28, suggesting the pre-product demonstration will be finalized by early 2027.

Consortium

Who built it

The consortium is highly balanced for commercialization, consisting of 15 partners with a 47% industry ratio (7 industrial partners, including coordinator STMicroelectronics). The presence of 7 universities and 1 research center ensures a strong R&D pipeline, while the heavy industrial weight suggests a clear focus on translating the 28nm PCM technology into a mass-producible product.

How to reach the team

Contact STMicroelectronics SRL regarding the NeuroSoC PCM-based NPU IP

Next steps

Talk to the team behind this work.

Contact us to explore licensing opportunities for the NeuroSoC IP