Imagine replacing the bulky, electronic parts of an ultrasound machine with tiny light-based circuits. Instead of using electricity to 'hear' echoes, this system uses light to detect sound waves with incredible precision. It's like upgrading from a blurry old TV to a 4K screen, allowing doctors to see deeper and clearer without needing powerful, expensive lasers.
Current ultrasound and photoacoustic imaging are limited by sensitivity, high laser costs, and the use of non-recyclable materials like lead. This restricts image depth and increases the cost of high-end diagnostic equipment.
A high-sensitivity Integrated Photonic Ultrasound Transducer (IPUT) using SOI and SiN membranes. Deliverables include a comprehensive requirements document and system architecture for two demonstrators.
If you are an ultrasound machine OEM dealing with limited image resolution and penetration depth — this project developed IPUT sensors that increase sensitivity by up to 100 times. This allows for a 2x increase in image quality and a 2.3x increase in penetration depth.
If you are a photoacoustic imaging developer dealing with the high cost of powerful lasers — this project developed a sensing system that requires 100x less laser power. This enables the use of low-cost lasers while maintaining high diagnostic quality.
If you are a medical sensor manufacturer dealing with lead-based materials and low production yields — this project developed a recyclable SOI and SiN manufacturing process. It removes the need for lead while improving the manufacturability of transducer arrays.
The technology enables a 100x reduction in required laser power, which allows manufacturers to use low-cost lasers instead of expensive high-power versions.
The project focuses on mass parallelization via optical multiplexing and the development of an iterative SOI and SiN manufacturing process to increase production yield.
Based on available project data, the project is in the development and demonstration phase; specific licensing terms are not provided.
The project specifically addresses the hybrid integration of microelectronics into Photonic Integrated Circuits (PIC) and fiber chip coupling.
The project runs from 2023-01-01 to 2026-12-31, suggesting that commercial versions would follow the 2026 completion date.
The consortium is well-balanced for commercialization, featuring a 40% industry ratio with 2 SMEs and 3 research organizations across 5 countries. Led by TNO, the group covers the entire value chain from chip design and fabrication (SOI/SiN) to packaging and medical validation, reducing the risk of technology transfer gaps.
Contact TNO (Netherlands) regarding the IPUT sensor manufacturing process.
Contact us to explore licensing opportunities for high-sensitivity photonic ultrasound transducers.
