If you are a telecom infrastructure company struggling to backhaul data from dense small-cell base stations in urban areas — this project built a complete point-to-point communication link prototype operating between 100 GHz and 500 GHz. It delivers fiber-like speeds wirelessly, eliminating the need to dig trenches for fiber to every rooftop cell. Ericsson drove the primary prototype development as the key technology end-user.
Low-Cost Terahertz Chips for Ultra-Fast Wireless Links and Industrial Sensors
There's a huge chunk of the radio spectrum — between microwaves and infrared light — that nobody can use cheaply yet. Think of it like a wide-open highway with no on-ramps. M3TERA built a miniaturized chip platform that finally lets manufacturers mass-produce tiny, affordable devices operating in this terahertz band. That means wireless data links fast enough to replace fiber optic cables, plus sensors that can check food quality or spot defects without touching anything.
What needed solving
Wireless networks are running out of spectrum. Urban 5G/6G small-cell deployments need fiber-speed backhaul between base stations, but digging trenches for fiber to every rooftop is slow and expensive. Meanwhile, industries like food manufacturing need non-contact, non-destructive inspection tools that current sensor technology cannot deliver affordably at scale.
What was built
The team built a micromachined integration platform for terahertz systems, plus two working prototypes: a point-to-point telecom communication link operating between 100 GHz and 500 GHz (driven by Ericsson), and a multi-function adaptive sensor platform for food safety, medical, and industrial sensing applications. A total of 8 deliverables were completed, including 2 hardware demonstrators.
Who needs this
Who can put this to work
If you are a food manufacturer dealing with contamination risks or inconsistent product quality — this project developed a multi-function adaptive terahertz sensor platform for food quality control and food safety monitoring. The sensor can inspect products without physical contact or destruction, catching problems before they reach consumers. The technology was designed for volume manufacturing from the start.
If you are a semiconductor manufacturer looking to expand into the terahertz product space — this project created a micromachined heterogeneous integration platform designed specifically for volume manufacturing. The platform is built to accommodate multiple generations of future products across different application fields. High-volume manufacturer IFAT was directly involved in the consortium, providing system packaging concepts.
Quick answers
What would it cost to adopt this terahertz technology?
Based on available project data, the entire platform was designed around low-cost, volume-manufacturable production. The project specifically targeted cost- and energy-efficient systems to enable large-scale commercialization. Exact unit pricing is not published in the project data, so licensing or manufacturing cost discussions would need to go through the consortium partners.
Can this scale to mass production?
Yes — scaling was a core design goal, not an afterthought. The consortium included IFAT, a high-volume semiconductor and microsystems manufacturer who provided system packaging concepts. The integration platform was explicitly designed to be volume-manufacturable and to accommodate multiple generations of future products.
What is the IP situation and how can I license this?
The project was funded under an RIA (Research and Innovation Action) with 7 partners across 4 countries. IP is typically shared among consortium members under Horizon 2020 rules. Licensing discussions would need to involve the relevant technology owners within the consortium, particularly the manufacturing and design partners.
How far along is this technology — can I use it today?
The project delivered complete THz microsystem prototypes including the microsystem platform with integrated MEMS-tuneable components, sensor and antenna interfaces, and active circuits. Both a telecom proof-of-concept prototype and a sensor prototype were demonstrated. However, the project ended in 2018, so current status of commercialization would need to be confirmed with the partners.
What frequency range does this actually cover?
The platform operates in the submillimeter-wave and terahertz range between 100 GHz and 1 THz. The primary telecom application targets 100 GHz to 500 GHz specifically. This covers the heavily sought-after frequency space that existing commercial electronics struggle to reach affordably.
Does this meet telecom industry standards and regulations?
The primary prototype was driven by Ericsson as the key technology end-user, specifically targeting high-density small-cell base-station networks for urban mobile communications. Based on available project data, regulatory compliance details are not explicitly documented, but Ericsson's direct involvement suggests alignment with telecom industry requirements.
What deployment scenario was this tested for?
The telecom prototype was designed for point-to-point high-speed communication links deployed in high-density small-cell base-station networks providing ubiquitous high-speed internet access in urban environments. The sensor prototype targeted multiple applications including food safety monitoring, medical diagnosis, and industrial sensing.
Who built it
This is a strongly industry-driven consortium with 4 out of 7 partners (57%) coming from the private sector, including 2 SMEs. The lineup is built for commercialization: Ericsson provides real-world telecom requirements and validation as the key end-user, while IFAT brings high-volume semiconductor manufacturing capability and packaging expertise. The consortium spans 4 countries (Austria, Switzerland, Spain, Sweden), with coordination handled by an Austrian SME specializing in EU project management. The presence of only 2 universities and 1 research organization, compared to 4 industry players, signals this project was designed to move technology toward market rather than stay in the lab.
- TECHNIKON FORSCHUNGS- UND PLANUNGSGESELLSCHAFT MBHCoordinator · AT
- INFINEON TECHNOLOGIES AUSTRIA AGparticipant · AT
- CSEM CENTRE SUISSE D'ELECTRONIQUE ET DE MICROTECHNIQUE SA - RECHERCHE ET DEVELOPPEMENTparticipant · CH
- KUNGLIGA TEKNISKA HOEGSKOLANparticipant · SE
- ERICSSON ABparticipant · SE
- ANTERAL SLparticipant · ES
- CHALMERS TEKNISKA HOGSKOLA ABparticipant · SE
TECHNIKON Forschungs- und Planungsgesellschaft mbH (Austria) coordinated this project. Use SciTransfer's coordinator lookup service to get the right contact.
Talk to the team behind this work.
Want to explore terahertz technology for your telecom backhaul or industrial sensing needs? SciTransfer can connect you directly with the M3TERA team and help assess fit for your specific use case.