Imagine a tiny, super-efficient ear that can hear things humans can't, like a heart valve leaking or a machine part wearing out. This project builds these 'ears' using special materials that turn sound into electricity more efficiently than current tech. It also adds a smart brain to the sensor so it can process information instantly without draining the battery.
Current capacitive MEMS acoustic sensors are limited in performance and power efficiency. There is a high demand for miniaturized, low-power sensors for medical and industrial devices that can provide reliable data for a digital society.
A new generation of piezoelectric MEMS transducers, a system-level modeling platform, and AI-powered signal processing hardware accelerators.
If you are a medical device manufacturer dealing with bulky ultrasound equipment — this project developed an ultrasound patch and PMUT sensors that enable continuous patient monitoring in a small, low-power form factor.
If you are a predictive maintenance provider dealing with high energy costs for sensor networks — this project developed low-power MEMS transducers and AI algorithms that detect machine failures in real-time while saving energy.
If you are a hearing aid developer dealing with limited battery life and size constraints — this project developed a new generation of MEMS microphones that outperform capacitive technologies to improve sound quality and device longevity.
The project focuses on creating solutions that are specifically designed to be low cost, small in size, and low in power consumption to enable disruptive applications.
Based on available project data, the project involves 17 industry partners and focuses on microfabrication process refining and fabrication flow optimization to ensure scalability.
One of the primary objectives is to generate a strong IP portfolio to ensure European leadership and competitiveness in the international acoustic sensor market.
The project provides dedicated hardware accelerators, processors, and AI-powered algorithms for real-time, integrated signal processing.
The project runs from 2023-02-01 to 2026-04-30, with partners currently moving into the design and tape-out phase for Generation 2 (G2) chips.
The consortium is heavily industry-driven, with 17 industrial partners (61% of the group), including 10 SMEs. This strong commercial presence, led by Infineon Technologies Austria AG and supported by 5 universities and 6 research centers across 7 countries, suggests a high priority on commercial viability and industrial application over pure academic research.
Contact Infineon Technologies Austria AG regarding G2 chip testing and IP licensing.
Contact SciTransfer to connect with the Listen2Future consortium for early adoption of G2 acoustic sensors.
