Imagine if the glue holding your electronics together suddenly started growing tiny, invisible metal needles that cause short circuits. This is what happens when space hardware moves away from lead-based solder to eco-friendly alternatives. This work finds ways to stop those needles from growing so satellites stay functional in orbit. It's like finding a new, safe recipe for solder that doesn't break the machine.
The space industry faces a critical risk where eco-regulations (REACH) and market shifts toward lead-free components cause 'tin whiskers' to grow. These whiskers can cause catastrophic short-circuits in satellites, and there is currently a lack of fast, reliable tests to predict this failure.
The project is developing validated assembly solutions for lead-free electronics and a reliability model based on the evaluation of two specific lead-free solders.
If you are a satellite manufacturer dealing with the risk of catastrophic failure due to tin whiskers — this project developed validated assembly solutions and reliability models that ensure lead-free components don't short-circuit. This allows the use of modern COTS parts without risking the mission.
If you are an electronics supplier dealing with REACH regulatory pressures and the phase-out of leaded solder paste — this project developed an evaluation of two promising lead-free solders. This helps you align your product finishes with the needs of the European Space Sector.
If you are a hardware integrator dealing with the need for accelerated reliability testing for COTS devices — this project developed a method to determine activation energies for whisker growth. This allows you to predict component lifespan without waiting years for real-time test results.
Based on available project data, specific costs are not provided, although the project notes that transitioning to Pb-free soldering is an extensive and expensive undertaking for the industry.
The project is currently testing and validating assembly solutions and evaluating two specific lead-free solders to move toward industrial adoption in the space sector.
Based on available project data, there is no specific information regarding IP or licensing terms for the results.
The transition is driven by the REACH Candidate List of SVHC for Authorisation, as lead (Pb, CAS 7439-92-1) is now listed, creating a risk for the space sector.
The project runs from 2024-01-01 to 2026-12-31, building upon a roadmap delivered in 2020 by the ESCC Task Force.
The consortium is heavily industry-driven, with 9 out of 11 partners coming from the private sector (an 82% industry ratio). This indicates a strong commercial focus and a direct link to the supply chain, involving 4 countries (DE, ES, FI, FR) to ensure the transition is applicable across the European space manufacturing base.
Contact SCALIAN OP in France for details on Pb-free assembly validation.
Contact us to find a lead-free solder partner for your next satellite project.
