If you are a gas sensor manufacturer dealing with high production costs for methane detectors — this project developed a group-IV photonic platform that allows sensors to be made using standard 200mm CMOS processes, reducing costs.
CMOS-Compatible Mid-Infrared Light Sources and Sensors for Industrial Gas and Liquid Detection
Imagine if we could put a high-tech chemical laboratory on a tiny computer chip. Currently, the tools needed to 'see' invisible gases are bulky and expensive because they don't fit with standard chip manufacturing. This work creates a new material recipe that lets these sensors be printed using the same factories that make computer processors.
What needed solving
Mid-infrared sensors for gas and health detection are currently expensive and difficult to manufacture because they cannot be made using standard silicon chip factories.
What was built
A monolithic Group-IV photonic platform using SiGeSn alloys, including GeSn light sources and photodetectors integrated on PICs.
Who needs this
Who can put this to work
If you are an infrastructure operator dealing with hazardous oil and CH4 leaks — this project developed mid-infrared light sources and photodetectors that enable more precise and integrated leak detection systems.
If you are a device developer dealing with expensive, non-standard components for biological analysis — this project developed a monolithic Si-based photonic integrated circuit (PIC) for the 2-5 µm range to lower hardware costs.
Quick answers
How does this affect the production cost of sensors?
By using 200mm CMOS manufacturing processes, the technology enables cost-effective solutions for sensing compared to previous non-standard fabrication methods.
Can this be produced at an industrial scale?
Yes, the project specifically focuses on a monolithic solution compatible with state-of-the-art 200mm CMOS manufacturing, which is the industry standard for microelectronics.
What is the IP and licensing status of the GeSn alloys?
Based on available project data, the consortium includes leaders in CMOS-technology for growth and processing of GeSn alloys, but specific licensing terms are not disclosed.
How easily can these components be integrated into existing electronics?
The platform is designed to be fully CMOS-compatible, meaning the light sources and detectors can be integrated directly into photonic integrated circuits (PICs).
What is the timeline for market availability?
The project period runs from 2023-01-01 to 2027-02-28, suggesting that mature prototypes will be available toward the end of this window.
Who built it
The consortium is well-balanced for commercialization, featuring a 33% industry ratio with 3 industrial partners, including 2 SMEs specialized in gas and liquid sensing. The mix of 3 universities and 3 research organizations ensures a strong pipeline from fundamental material science (GeSn alloys) to a world-leading PIC design and test-house, reducing the gap between lab research and fab-ready technology.
Contact the Commissariat à l'énergie atomique et aux énergies alternatives (CEA) in France.
Talk to the team behind this work.
Contact us to connect with the LASTSTEP consortium for MIR sensing integration.