Imagine trying to paint tiny, precise lines on a chip, but the paint is too thick or the brush is too wide. This system uses a laser to precisely place materials, acting like a super-accurate 3D printer for electronics. It avoids the messy, polluting chemicals usually used to carve out circuits, making the process cleaner and much faster.
Current semiconductor backend processes are either too polluting (subtractive) or lack the resolution and speed (additive) to create smaller, more powerful chips.
The io600 system, featuring a Continuous Laser-Assisted Deposition (CLAD) unit and a high-volume handling system with a 600x600mm vacuum chuck and conveyor.
If you are a packaging company dealing with the resolution limits of screen printers and needle dispensers — this project developed the io600 system that provides 50% to 100% higher resolution and 35 times faster dispensing.
If you are a chip designer dealing with physical space constraints on boards — this project developed a laser deposition system that enables a 10% improvement in die-density for smaller, more powerful chips.
If you are a PCB manufacturer dealing with high water consumption and hazardous waste — this project developed a CLAD technology that saves 1 m3 of water per m2 and eliminates hazardous chemicals.
The io600 system offers a 40% lower CAPEX compared to existing solutions and requires 80% less clean room space.
Yes, the system is designed for high-volume deposition on 600x600mm substrates and is 35 times faster than traditional dispensing systems.
Based on available project data, the technology is developed by REOPHOTONICS LTD, but specific licensing terms are not provided.
Yes, it aligns with the EU Green Deal by removing hazardous chemicals and reducing water usage by 1 m3 per m2 in PCB manufacturing.
Based on available project data, the project period runs from October 2024 to March 2027.
The project is led by a single SME, REOPHOTONICS LTD from Israel. With a 100% industry ratio and no university or research institute partners, the project is heavily driven by commercial application and direct industrial implementation rather than academic exploration.
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