If you are a nano-satellite manufacturer dealing with limited space and power for navigation — this project developed monolithic PIC building-blocks that provide high-performance inertial sensing with low Size-Weight-and-Power-consumption (SWaP) factors.
High-Precision Miniaturized Optical Sensors for Autonomous Navigation and Space Tracking
Imagine trying to fit a giant, heavy laboratory laser into a tiny drone or a nano-satellite. This project shrinks those complex light-based tools onto a single small chip using a special material called Indium Phosphide. It's like replacing a room full of equipment with a single computer chip that can 'see' and 'feel' movement with incredible precision.
What needed solving
Current high-performance optical sensors are too bulky and power-hungry for nano-satellites and drones. Existing silicon photonics often lack the reliability needed for these extreme environments.
What was built
A monolithic Indium Phosphide (InP) platform featuring an integrated optical gyroscope and a dual-band mid-infrared FMCW lidar on a multi-chip module.
Who needs this
Who can put this to work
If you are an autonomous vehicle developer dealing with noisy environments for object tracking — this project developed a dual-band mid-infrared FMCW lidar that enables more reliable ranging and sensor-fusion for self-driving units.
If you are an industrial drone producer dealing with the need for precise positioning without GPS — this project developed an integrated optical gyroscope that allows for miniaturized, high-accuracy inertial navigation.
Quick answers
What is the cost or price of these components?
Based on available project data, specific pricing is not provided; however, the project focuses on reducing Size-Weight-and-Power-consumption (SWaP) to lower overall system costs.
Can this be produced at an industrial scale?
Yes, the project aims to validate wafer-scale processes and promote a European InP-based process design kit and supply chain to enable technological scale-up.
How is the IP and licensing handled?
Based on available project data, the project seeks to establish an independent European supply chain, but specific licensing terms are not detailed.
How do these sensors integrate into existing systems?
The components are integrated into a multi-chip module board, allowing for a multi-sensorial unit that combines ranging and inertial sensing capabilities.
What is the timeline for market availability?
The project period runs from 2023-12-01 to 2027-11-30, suggesting that validated modules will be available toward the end of 2027.
Who built it
The consortium is heavily weighted toward commercial application, with a 56% industry ratio consisting of 5 industrial partners (including 3 SMEs) and 4 universities. This balance suggests a strong transition path from academic research to industrial productization, coordinated by an Italian SME, G.E.M. ELETTRONICA SRL.
Contact G.E.M. ELETTRONICA SRL in Italy
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