If you are a headset manufacturer dealing with low brightness and low resolution in micro-displays — this project developed sub-1µm high efficiency microLEDs that enable ultra-high resolution displays for VR and AR.
Ultra-High Resolution Micro LED Displays for AR, VR, and Next-Gen Screens
Imagine building a screen out of tiny, perfect light-bulbs instead of flat sheets of material. By growing these lights as tiny pyramids, the team removes the flaws that usually make small screens dim or inefficient. This allows for incredibly sharp images that stay bright even when the pixels are smaller than a micron.
What needed solving
Current microLEDs lose efficiency when pixels shrink below 10µm, limiting the resolution and brightness of AR/VR displays. Manufacturing these displays is also complex and costly due to the difficulty of integrating different colored LEDs.
What was built
A unique InGaN epitaxial platform that grows defect-free pyramids (platelets) to create high-efficiency red microLEDs on silicon wafers.
Who needs this
Who can put this to work
If you are a HUD provider dealing with energy inefficiency and integration complexity — this project developed a bottom-up InGaN platelet technology that simplifies manufacturing and reduces energy consumption.
If you are a TV producer dealing with the high cost of integrating red, green, and blue LEDs — this project developed a method to integrate all three colors on the same epitaxial wafer to simplify production.
Quick answers
How does this impact the cost of display production?
Based on available project data, the technology allows for a simplified integration flow and a lower cost production process by enabling red, green, and blue LEDs on a single wafer.
Can this be produced at an industrial scale?
The project aims to scale the technology to 150mm (6 inch) silicon wafers, moving up from previous 2 inch sapphire wafer demonstrations.
What is the IP or licensing status?
Based on available project data, the project is engaging with industrial partners to secure joint development programs, though specific licensing terms are not listed.
How does it integrate with existing manufacturing?
The technology uses a bottom-up growth method that avoids plasma processes, which prevents material damage and simplifies the manufacturing flow.
What is the timeline for market availability?
The project period runs from 2023-02-01 to 2025-06-30, indicating it is currently in the development and scaling phase.
Who built it
The project is led by a single SME, HEXAGEM AB from Sweden. This indicates a highly concentrated IP position and a lean, industry-driven approach with a 100% industry ratio, focusing on direct commercialization rather than academic research.
Contact HEXAGEM AB regarding joint development programs for InGaN microLEDs.
Talk to the team behind this work.
Contact us to connect with HEXAGEM AB for pilot integration.