SciTransfer
Impulse Printing · Project

High-Speed 3D Printing for Semiconductor and Micro-LED Packaging Interconnects

manufacturingTestedTRL 7

Imagine printing tiny electrical wires on a chip like using a giant stamp instead of a slow pen. Instead of drawing one line at a time, this technology pushes thousands of connections onto a surface instantly. It removes the need for wasteful chemical etching, making the process faster and cleaner.

By the numbers
100,000
interconnects per second deposition rate
14
patents
533 M
projected revenue by 2030 in Euro
10,000
prints with >99% yield per single impulse plate
10
minimum feature size in micrometers
The business problem

What needed solving

Current semiconductor packaging relies on slow nozzle-based printing or wasteful chemical etching. This creates production bottlenecks and high material costs for high-volume manufacturing.

The solution

What was built

A mask-based parallel deposition system consisting of consumable Impulse Printing plates and controlled energy Impulse Printheads.

Audience

Who needs this

Semiconductor packaging firmsMicro-LED display manufacturersHigh-volume electronic device OEMsSemiconductor equipment system integrators
Business applications

Who can put this to work

Semiconductor Manufacturing
enterprise
Target: Chip packaging provider

If you are a chip packaging provider dealing with slow production bottlenecks from sequential dispensing — this project developed a mask-based parallel deposition technology that achieves deposition rates of over 100,000 interconnects per second.

Display Technology
enterprise
Target: Micro-LED manufacturer

If you are a Micro-LED manufacturer dealing with the need for extreme miniaturization — this project developed printing technology that attains feature sizes ranging from <10 µm to >100 µm in 3D.

Electronics Assembly
enterprise
Target: High-volume electronic device manufacturer

If you are a high-volume electronic device manufacturer dealing with high material waste from subtractive etching — this project developed an additive process that eliminates chemical etching steps and reduces material consumption.

Frequently asked

Quick answers

What is the cost advantage of this technology?

The technology is designed for the lowest cost of ownership and a minimal facility footprint compared to conventional lithography-based processes.

Can this be scaled for mass production?

Yes, the technology has been scaled from 50mm laboratory plates to 200mm production-relevant dimensions, capable of over 100,000 interconnects per second.

What is the IP status and licensing potential?

The technology is safeguarded by 14 patents and is intended for direct sales or through system integrators.

How does it integrate into existing lines?

Based on available project data, it replaces subtractive lithography/etching or nozzle-based dispensing with a system consisting of Impulse Printing plates and Printheads.

What is the expected commercial timeline?

The project runs from 2025-01-01 to 2026-12-31, with a revenue target of €533 M by 2030.

Consortium

Who built it

The consortium is highly streamlined, consisting of 2 partners, both of which are SMEs based in the Netherlands. This 100% industry ratio indicates a strong focus on commercialization and rapid productization rather than academic research, leveraging a direct spin-off relationship from the TNO research institute.

How to reach the team

Contact FONONTECH HOLDING BV in the Netherlands

Next steps

Talk to the team behind this work.

Contact us to explore licensing or integration of Impulse Printing technology.

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