If you are a chip packaging provider dealing with slow production bottlenecks from sequential dispensing — this project developed a mask-based parallel deposition technology that achieves deposition rates of over 100,000 interconnects per second.
High-Speed 3D Printing for Semiconductor and Micro-LED Packaging Interconnects
Imagine printing tiny electrical wires on a chip like using a giant stamp instead of a slow pen. Instead of drawing one line at a time, this technology pushes thousands of connections onto a surface instantly. It removes the need for wasteful chemical etching, making the process faster and cleaner.
What needed solving
Current semiconductor packaging relies on slow nozzle-based printing or wasteful chemical etching. This creates production bottlenecks and high material costs for high-volume manufacturing.
What was built
A mask-based parallel deposition system consisting of consumable Impulse Printing plates and controlled energy Impulse Printheads.
Who needs this
Who can put this to work
If you are a Micro-LED manufacturer dealing with the need for extreme miniaturization — this project developed printing technology that attains feature sizes ranging from <10 µm to >100 µm in 3D.
If you are a high-volume electronic device manufacturer dealing with high material waste from subtractive etching — this project developed an additive process that eliminates chemical etching steps and reduces material consumption.
Quick answers
What is the cost advantage of this technology?
The technology is designed for the lowest cost of ownership and a minimal facility footprint compared to conventional lithography-based processes.
Can this be scaled for mass production?
Yes, the technology has been scaled from 50mm laboratory plates to 200mm production-relevant dimensions, capable of over 100,000 interconnects per second.
What is the IP status and licensing potential?
The technology is safeguarded by 14 patents and is intended for direct sales or through system integrators.
How does it integrate into existing lines?
Based on available project data, it replaces subtractive lithography/etching or nozzle-based dispensing with a system consisting of Impulse Printing plates and Printheads.
What is the expected commercial timeline?
The project runs from 2025-01-01 to 2026-12-31, with a revenue target of €533 M by 2030.
Who built it
The consortium is highly streamlined, consisting of 2 partners, both of which are SMEs based in the Netherlands. This 100% industry ratio indicates a strong focus on commercialization and rapid productization rather than academic research, leveraging a direct spin-off relationship from the TNO research institute.
Contact FONONTECH HOLDING BV in the Netherlands
Talk to the team behind this work.
Contact us to explore licensing or integration of Impulse Printing technology.