Imagine a computer chip that doesn't melt in an oven or glitch in space. Instead of using standard electronic switches, this project uses tiny mechanical switches that physically move to connect circuits. Because they are mechanical, they don't leak power when idle and can survive conditions that would fry a normal smartphone chip.
Standard semiconductor electronics fail in high-temperature or high-radiation environments, making real-time edge computing impossible in sectors like aerospace and heavy industry.
A proof-of-concept System-on-Chip (SoC) IoT node featuring a NEM-based FPGA, non-volatile memory, and a Physical Design Kit (PDK) for simulation.
If you are a spacecraft manufacturer dealing with ionizing radiation in orbit — this project developed NEM-based hardware that resists radiation doses up to 1 Mrad. This ensures the onboard edge computing remains functional without failing due to radiation-induced glitches.
If you are a sensor provider dealing with extreme heat in industrial furnaces — this project developed a System-on-Chip that operates reliably at ambient temperatures reaching 300°C. This allows for real-time condition monitoring directly inside the heat zone.
If you are a monitoring firm dealing with high power-consumption constraints in remote areas — this project developed switches with zero standby power consumption. This significantly extends the battery life of edge nodes used for power generation telemetry.
Based on available project data, specific pricing or unit costs are not provided as the project focuses on developing a proof-of-concept demonstrator.
The project is establishing a roadmap for pilot manufacturing within Europe and includes a multidisciplinary supply chain to facilitate the transition from lab to fab.
Based on available project data, specific licensing terms are not mentioned, but the project provides a Physical Design Kit (PDK) to help application engineers implement the technology.
Integration is supported by a dedicated Physical Design Kit (PDK) containing models for design and circuit simulation to streamline the process for engineers.
The project runs from 2023-01-01 to 2026-12-31, aiming to move the technology from TRL 3 to TRL 5 by the end of the period.
The consortium is well-balanced for commercialization, featuring 8 partners across 6 countries with a 38% industry ratio. The inclusion of 3 industrial partners and 2 SMEs, alongside 3 universities and 1 research center, indicates a strong push to move the technology through the supply chain from cell design to pilot manufacturing.
Contact GESELLSCHAFT FUR ANGEWANDTE MIKRO UND OPTOELEKTRONIK MIT BESCHRANKTERHAFTUNG AMO GMBH in Germany
Contact us to connect with the i-EDGE consortium for PDK access and pilot integration.
