Imagine printing computer chips like we print newspapers, but with the speed and power of high-end silicon. Right now, printed electronics are slow because electricity struggles to jump between the tiny flakes of material used. This project uses a chemical 'glue' and specially shaped flakes to create a smooth highway for electricity, making these flexible circuits 10 to 100 times faster than current versions.
Current printed electronics are too slow (100x slower than silicon) for advanced computing, while 2D nanosheet alternatives suffer from high junction resistance that kills performance.
A method to create covalently interconnected networks of 2D nanosheets and high-aspect-ratio sheets to reduce junction resistance. This is being used to build printed digital and analog circuits for wearable sensors.
If you are a medical device manufacturer dealing with bulky, rigid sensors that lack processing power — this project developed high-mobility printed networks that enable integrated, wearable sensor arrays. This allows for the creation of flexible, skin-like diagnostics that can read and amplify signals directly on the body.
If you are an IoT developer dealing with the high cost of silicon-based circuitry for disposable or flexible sensors — this project developed ultra-cheap printed devices with performance 10–100 times beyond the state-of-the-art. This enables high-performance computing in low-cost, deformable form factors.
If you are a logistics provider dealing with the need for cheap, large-area electronic monitoring on flexible surfaces — this project developed printed digital and analog circuits using 2D nanosheets. This provides a way to integrate high-speed signal amplification into flexible packaging.
Based on available project data, the technology focuses on 'ultra-cheap' printed devices using solution-processed 2D materials, which avoids the expensive fabrication processes required for traditional silicon electronics.
Based on available project data, the project uses printing techniques and solution-processed materials designed for large-area junctions, though specific industrial throughput rates are not provided.
Based on available project data, the project is in the research and demonstration phase; specific patent or licensing details are not listed in the provided summary.
The project demonstrates utility by using the networks as complementary field-effect devices in integrated, wearable sensor arrays that read and amplify signals.
The project period runs from 2024-04-01 to 2028-03-31, suggesting that commercial-ready demonstrations will be finalized toward the end of this window.
The consortium is heavily research-oriented, consisting of 6 universities and 2 industry partners (including 1 SME) across 5 countries. With a 25% industry ratio, the project is primarily driven by academic discovery at the Universite de Strasbourg, but includes industrial participation to ensure the resulting printed circuits have a path toward commercial application.
Contact the Universite de Strasbourg research office regarding the HYPERSONIC project.
Contact us to find a partner for integrating high-mobility printed electronics into your hardware roadmap.
