Imagine trying to carve a complex 3D sculpture using a flat stamp; usually, you'd have to do it layer by layer, which is slow and expensive. This technology acts like a magic lens that projects a full 3D shape all at once with incredible detail. It removes the need for expensive, fragile equipment and toxic chemicals, making high-tech chip making much cheaper.
Current semiconductor manufacturing is limited to 2D imaging and faces a trade-off between depth and resolution. This makes 3D manufacturing impractical and prohibitively expensive due to complex optics and toxic materials.
The HS-345 industrial prototype, featuring a 20W UV fibre laser, a 37-channel adaptive optics module, and a vector diffraction software engine.
If you are an IC producer dealing with the rising costs and 2D limits of projection lithography — this project developed a holographic stepper that enables 200 nm resolution and 25 nm overlay precision. This allows for affordable production of high-resolution circuits without expensive projection optics.
If you are a sensor manufacturer dealing with the inability to create complex 3D topographies at scale — this project developed the HS-345 prototype that produces complex 3D structures in a single exposure. This increases design freedom for micro-optical components.
If you are a MEMS developer dealing with high defect rates and toxic material requirements — this project developed a holographic lithography method that is not sensitive to mask defects. This reduces the need for frequent mask replacements and eliminates toxic materials.
It eliminates the need for complex projection optics and frequent mask replacements because holographic images are not sensitive to mask defects. It also reduces energy consumption by using low-power lasers and creating complex structures in one exposure.
The industrial prototype is being validated for a throughput of 100 wafers per hour or more in a cleanroom environment.
Based on available project data, the project is in the prototype and validation phase; specific licensing terms are not provided.
The system achieves sub-10 nm coordinate accuracy, which translates to less than 25 nm overlay precision in final use.
The project period runs from 2024-01-01 to 2027-12-31, suggesting the industrial prototype validation will conclude by the end of 2027.
The consortium is heavily industry-weighted with 60% industrial partners (6 companies), including 5 SMEs. This strong commercial presence, combined with 2 universities and 2 research institutes across 6 countries, indicates a clear path from laboratory validation to industrial application.
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