Imagine if different types of computer chips, which usually don't play well together, could be fused into one super-chip. This project mixes silicon and specialized materials to move data faster and use less power. It's like upgrading a city's narrow roads to a high-speed rail system to stop traffic jams in the cloud.
Current cloud computing is too centralized, causing high latency and energy waste. Additionally, automotive radar lacks the sensing precision required for fully automated driving.
Heterogeneous integration (HI) pilot lines and system prototypes, including SiPh and InP modules and HI-based PCB integrations.
If you are an autonomous vehicle manufacturer dealing with the difficulty of sensing objects for Highly Automated Driving (HAD) — this project developed heterogeneous integration (HI) components that improve radar sensing and processing speed.
If you are a network provider dealing with massive IoT data growth and high latency — this project developed HI-based networking cards and switches that enable faster, more stable connections between cloud nodes and mobile devices.
If you are a medical device company dealing with the need for real-time data analysis in public health monitoring — this project developed HI core technology solutions that bring AI and computing closer to the end-user for better response times.
Based on available project data, specific pricing or cost-per-unit information is not provided.
Yes, the project includes 'Heterogeneous integration pilot lines' and 'systems productization' involving 52 industry partners to ensure manufacturing viability.
Based on available project data, the specific licensing terms are not disclosed, though the consortium includes 67 partners across 15 countries.
The project runs from 2023-01-01 to 2026-09-30, with some pilot lines and PCB manufacturing planned for May 2025.
It integrates via new networking cards and switches designed to transform centralized cloud platforms into decentralized edge computing platforms.
The consortium is heavily industry-driven, with 52 companies representing 78% of the 67 total partners. This high ratio of industrial players, including giants like NXP and NVIDIA alongside 19 SMEs, indicates a strong focus on commercial viability and productization rather than purely academic research.
Contact NXP Semiconductors Germany GmbH
Contact us to connect with the HICONNECTS consortium for pilot line access.
